Display panel and the manufacturing method thereof, and display device

• US 10,684,502 B2
• Filed: 01/17/2018
• Issued: 06/16/2020
• Est. Priority Date: 12/29/2017
• Status: Active Grant

• Current Assignee: Huizhou China Star Optoelectronics Technology Co., Ltd.
• Original Assignee: Huizhou China Star Optoelectronics Technology Co., Ltd.
• Inventors: Que, Chengwen, Fan, Yong
• Primary Examiner(s): Kim, Richard H
• Application Number:
  US15/754,541
• Publication Number:
  US 20190384096A1
• Time in Patent Office: 881 Days
• Field of Search: None
• CPC Class Codes: G02F 1/133512 Light shielding layers, e.g. black matrix G02F1/136209 takes precedence
• CPC Class Codes: G02F 1/133514 Colour filters
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/136209 Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
• CPC Class Codes: G02F 1/136286 Wiring, e.g. gate line, drain line

Abstract

Disclosed are a display panel and manufacturing method thereof and a display device. The display panel includes a first substrate, a second substrate, a chip on film, and a shading array layer. The end of the first substrate extending beyond the second substrate forms a bonding end and the chip on film is bonded onto inner side of the bonding end. The inner surface of the first substrate is provided with metal signal wires located in non-pixel area. The shading array layer is located in the non-pixel area and completely shades the wires. Because the first substrate faces the viewer and the chip on film is bonded onto the inner side of bonding end, a bezel-less design is attained. The patterned shading layer forms a pattern corresponding to the metal signal wires to shade the wires for weakening lights reaching the wires and reducing reflectiveness of wires.

Claims

1. A display panel, comprising:

a first substrate;

a second substrate;

a chip on film; and

a shading array layer;

wherein the first substrate is opposite to and spaced from the second substrate, and the end of the first substrate extending beyond the second substrate forms a bonding end;

wherein the chip on film is bonded onto a surface of the bonding end facing the second substrate, and the first substrate is closer to a light output surface than the second substrate is; and

wherein an inner surface of the first substrate is provided with metal signal wires located in a non-pixel area, and the shading array layer is located in the non-pixel area and completely shades the metal signal wires,

wherein an inner surface of the second substrate is provided with color resistances formed in a pixel area and black matrices formed in the non-pixel area, and a combinative projection of the shading array layer and the black matrices on the second substrate is located in the non-pixel area and completely covers the non-pixel area;

wherein each black matrix fills in a gap between each adjacent color resistance;

wherein a thickness of a portion of the black matrices shaded by the shading array layer is smaller than a thickness of the rest of the black matrices.

2. The display panel according to claim 1, wherein a thickness of the black matrices is smaller than a thickness of the color resistances.

3. The display panel according to claim 1, wherein a hollowed-out area of the shading array layer is filled with a transparent material.

4. The display panel according to claim 1, wherein the shading array layer is photoresist.

5. A manufacturing method for a display panel, wherein the display panel comprises a first substrate, a second substrate, a chip on film, and a shading array layer, wherein the first substrate is opposite to and spaced from the second substrate, and the end of the first substrate extending beyond the second substrate forms a bonding end, and wherein the chip on film is bonded onto a surface of the bonding end facing the second substrate, and the first substrate is closer to a light output surface than the second substrate is, and wherein an inner surface of the first substrate is provided with metal signal wires located in a non-pixel area, and the shading array layer is located in the non-pixel area and completely shades the metal signal wires, wherein the manufacturing method comprising the steps of;

providing a liquid crystal cell, which comprises a first substrate, a second substrate, and liquid crystals filled therebetween;

fabricating a shading film layer on a surface of the first substrate away from the second substrate;

exposing the shading film layer by a lithography mask;

etching off an exposed portion of the shading film layer, thereby forming a patterned shading array layer aligning with the metal signal wires on the first substrate; and

respectively adhering an upper polarizer and a lower polarizer to an outer surface of the shading film layer and an outer surface of the second substrate,

wherein in the liquid crystal cell, an inner surface of the second substrate is provided with color resistances formed in a pixel area and black matrices formed in the non-pixel area, and a combinative projection of the shading array layer and the black matrices on the second substrate is located in the non-pixel area and completely covers the non-pixel area, and each black matrix fills in a gap between each adjacent color resistance;

wherein a thickness of a portion of the black matrices shaded by the shading array layer is smaller than a thickness of the rest of the black matrices.

6. The manufacturing method according to claim 5, wherein a thickness of the black matrices is smaller than a thickness of the color resistances.

7. A display device, comprising:

a backlight module; and

a display panel, wherein the display panel comprises;

a first substrate;

a second substrate;

a chip on film; and

a shading array layer;

wherein the first substrate is opposite to and spaced from the second substrate, and the end of the first substrate extending beyond the second substrate forms a bonding end;

wherein the chip on film is bonded onto a surface of the bonding end facing the second substrate, and the first substrate is closer to a light output surface than the second substrate is;

wherein an inner surface of the first substrate is provided with metal signal wires located in a non-pixel area, and the shading array layer is located in the non-pixel area and completely shades the metal signal wires; and

the backlight module is arranged at a side of the second substrate,

wherein an inner surface of the second substrate is provided with color resistances formed in a pixel area and black matrices formed in the non-pixel area, and a combinative projection of the shading array layer and the black matrices on the second substrate is located in the non-pixel area and completely covers the non-pixel area;

wherein each black matrix fills in a gap between each adjacent color resistance;

wherein a thickness of a portion of the black matrices shaded by the shading array layer is smaller than a thickness of the rest of the black matrices.

8. The display device according to claim 7, wherein a thickness of the black matrices is smaller than a thickness of the color resistances.

9. The display device according to claim 7, wherein the shading array layer is photoresist, and a hollowed-out area of the shading array layer is filled with a transparent material.