Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
First Claim
Patent Images
1. An apparatus comprising:
- a substrate including;
a first channel;
a second channel, the first channel substantially parallel to the second channel; and
a third channel, the third channel substantially orthogonal to the second channel;
a first wickless capillary driven constrained vapor bubble heat pipe embedded in the first channel, the first wickless capillary driven constrained vapor bubble heat pipe including a first capillary, the first capillary including;
a first curved wall;
a first linear wall directly coupled to the first curved wall;
a second curved wall;
a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall;
a first substantially square corner formed by the first linear wall and the second linear wall;
a third linear wall directly coupled to the second curved wall;
a third curved wall;
a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall; and
a second substantially square corner formed by the third linear wall and the fourth linear wall; and
a first amount of a liquid partially filling the first capillary to dissipate heat;
a second wickless capillary driven constrained vapor bubble heat pipe embedded in the second channel, the second wickless capillary driven constrained vapor bubble heat pipe including a second capillary with substantially square corners and a second amount of the liquid partially filling the second capillary to dissipate the heat; and
a third wickless capillary driven constrained vapor bubble heat pipe embedded in the third channel, the third wickless capillary driven constrained vapor bubble heat pipe including a third capillary with substantially square corners and a third amount of the liquid partially filling the third capillary to dissipate the heat.
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Abstract
A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
72 Citations
20 Claims
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1. An apparatus comprising:
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a substrate including; a first channel; a second channel, the first channel substantially parallel to the second channel; and a third channel, the third channel substantially orthogonal to the second channel; a first wickless capillary driven constrained vapor bubble heat pipe embedded in the first channel, the first wickless capillary driven constrained vapor bubble heat pipe including a first capillary, the first capillary including; a first curved wall; a first linear wall directly coupled to the first curved wall; a second curved wall; a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall; a first substantially square corner formed by the first linear wall and the second linear wall; a third linear wall directly coupled to the second curved wall; a third curved wall; a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall; and a second substantially square corner formed by the third linear wall and the fourth linear wall; and a first amount of a liquid partially filling the first capillary to dissipate heat; a second wickless capillary driven constrained vapor bubble heat pipe embedded in the second channel, the second wickless capillary driven constrained vapor bubble heat pipe including a second capillary with substantially square corners and a second amount of the liquid partially filling the second capillary to dissipate the heat; and a third wickless capillary driven constrained vapor bubble heat pipe embedded in the third channel, the third wickless capillary driven constrained vapor bubble heat pipe including a third capillary with substantially square corners and a third amount of the liquid partially filling the third capillary to dissipate the heat. - View Dependent Claims (2, 3)
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4. An apparatus comprising:
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a substrate; a first means for dissipating heat, the first means embedded in the substrate; and a second means for dissipating the heat, the second means embedded in the substrate substantially orthogonal to the first means, respective ones of the first and second means including an in-built channel, the in-built channel including; a first curved wall; a first linear wall directly coupled to the first curved wall; a second curved wall; a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall; a first substantially square corner formed by the first linear wall and the second linear wall; a third linear wall directly coupled to the second curved wall; a third curved wall; a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall; a second substantially square corner formed by the third linear wall and the fourth linear wall; and a fluid partially filling the in-built channel to dissipate the heat between an evaporator region and a condenser region of the in-built channel. - View Dependent Claims (5, 6, 7, 8)
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9. A method comprising:
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fabricating an electronic circuit into a substrate, the substrate including a first axis and a second axis, the second axis orthogonal to the first axis; forming a first channel in the substrate substantially orthogonally to the second axis; forming a second channel in the substrate substantially orthogonally to the second axis; forming a third channel in the substrate substantially orthogonally to the first axis; fabricating a first wickless capillary driven constrained vapor bubble heat pipe into the first channel, the first wickless capillary driven constrained vapor bubble heat pipe including a first capillary, the first capillary including; a first curved wall; a first linear wall directly coupled to the first curved wall; a second curved wall; a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall; a first substantially square corner formed by the first linear wall and the second linear wall; a third linear wall directly coupled to the second curved wall; a third curved wall; a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall; and a second substantially square corner formed by the third linear wall and the fourth linear wall, the first capillary to include a first amount of a liquid to partially fill the first capillary to dissipate heat; fabricating a second wickless capillary driven constrained vapor bubble heat pipe into the second channel, the second wickless capillary driven constrained vapor bubble heat pipe including a second capillary with substantially square corners, the second capillary to include a second amount of the liquid to partially fill the second capillary to dissipate the heat; and fabricating a third wickless capillary driven constrained vapor bubble heat pipe into the third channel, the third wickless capillary driven constrained vapor bubble heat pipe including a third capillary therein with substantially square corners, the third capillary to include a third amount of the liquid to partially fill the third capillary to dissipate the heat. - View Dependent Claims (10, 11, 12, 13)
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14. A system comprising:
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an electronic device embedded in a substrate; and a wickless capillary driven constrained vapor bubble heat pipe embedded in the substrate, the wickless capillary driven constrained vapor bubble heat pipe including; a capillary including; a first curved wall, a first linear wall directly coupled to the first curved wall, a second curved wall, a second linear wall directly coupled to the second curved wall, a first corner formed by two first intersecting walls, a first of the two first intersecting walls of the first corner connected to the first linear wall and a second of the two first intersecting walls of the first corner connected to the second linear wall, a third linear wall directly coupled to the second curved wall, a third curved wall, a fourth linear wall directly coupled to the third curved wall, and a second corner formed by two second intersecting walls, a first of the two second intersecting walls of the second corner connected to the third linear wall and a second of the two second intersecting walls of the second corner connected to the fourth linear wall; and a liquid partially filling the capillary to dissipate heat. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification