Multi-dimensional measurement using magnetic sensors and related systems, methods, and integrated circuits
First Claim
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1. A system for detecting a position of a magnetic target, the system comprising:
- an array of magnetic sensor integrated circuits (ICs), wherein a first magnetic sensor IC of the array comprises at least three first magnetic sensing elements and one or more first output contacts configured to provide first information indicative of a 3-dimensional (3D) position of the magnetic target, wherein the at least three first magnetic sensing elements comprise two magnetic sensing elements positioned on a first substrate plane and another magnetic sensing element positioned on a second substrate plane, the second substrate plane oriented at a non-zero angle relative to the first substrate plane, and wherein a second magnetic sensor IC of the array comprises at least three second magnetic sensing elements and one or more second output contacts configured to provide second information indicative of the 3D position of the magnetic target; and
a computation circuit configured to output 3D position information of the magnetic target positioned in proximity to the array based on the first information and the second information.
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Abstract
This disclosure describes, among other things, embodiments of devices, systems, and methods for using 3-dimensional (3D) magnetic sensors to detect the position of a magnetic target. By using 3D magnetic sensors, a two dimensional array of such magnetic sensors can be used to determine a 3D position of a magnetic target.
163 Citations
20 Claims
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1. A system for detecting a position of a magnetic target, the system comprising:
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an array of magnetic sensor integrated circuits (ICs), wherein a first magnetic sensor IC of the array comprises at least three first magnetic sensing elements and one or more first output contacts configured to provide first information indicative of a 3-dimensional (3D) position of the magnetic target, wherein the at least three first magnetic sensing elements comprise two magnetic sensing elements positioned on a first substrate plane and another magnetic sensing element positioned on a second substrate plane, the second substrate plane oriented at a non-zero angle relative to the first substrate plane, and wherein a second magnetic sensor IC of the array comprises at least three second magnetic sensing elements and one or more second output contacts configured to provide second information indicative of the 3D position of the magnetic target; and a computation circuit configured to output 3D position information of the magnetic target positioned in proximity to the array based on the first information and the second information. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of determining a position of a magnetic target, the method comprising:
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determining a coarse position of the magnetic target to identify a group of magnetic sensors of an array of magnetic sensors that generate a respective signal that satisfies a threshold; measuring a rotation of the magnetic target based on measurements of magnetic sensors of the group of magnetic sensors, wherein magnetic sensors of the array each comprise two magnetic sensing elements on a first substrate and a third magnetic sensing element on a second substrate that is oriented at a non-zero angle relative to the first substrate, the second substrate being different than the first substrate; and determining a fine position of the magnetic target based on measurements of magnetic sensors of the group of magnetic sensors. - View Dependent Claims (12, 13, 14, 20)
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15. An magnetic sensor for detecting a position of a magnetic target, the magnetic sensor comprising:
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a first magnetic sensing element and a second magnetic sensing element positioned on a first substrate plane; a third magnetic sensing element and a fourth magnetic sensing element positioned on a second substrate plane oriented at a non-zero angle relative to the first substrate plane, wherein a single integrated circuit includes the first, second, third, and fourth magnetic sensing elements; and one or more output contacts of the single integrated circuit configured to provide information from the first, second, third, and fourth magnetic sensing elements indicative of a 3-dimensional (3D) position of the magnetic target. - View Dependent Claims (16, 17, 18, 19)
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Specification