Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same

  • US 10,703,947 B2
  • Filed: 05/03/2018
  • Issued: 07/07/2020
  • Est. Priority Date: 03/12/2010
  • Status: Active Grant
First Claim
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1. A method of adjusting a polishing rate, comprising:

  • adjusting light transmittance produced by abrasive grains including tetravalent cerium hydroxide particles to at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, andpolishing at least a portion of a film to be polished while supplying a slurry comprising the abrasive grains between an abrasive pad and the film to be polished.

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