Chip electronic component

• US 10,707,012 B2
• Filed: 12/07/2015
• Issued: 07/07/2020
• Est. Priority Date: 12/10/2014
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Jeong, Jong Suk, Hur, Kang Heon, Lee, Seong Jae, Seo, Jung Wook, Matsumoto, Hiroyuki, Sim, Chul Min, Yoon, Jong Sik
• Primary Examiner(s): Hinson, Ronald
• Application Number:
  US14/961,414
• Publication Number:
  US 20160172098A1
• Time in Patent Office: 1,674 Days
• Field of Search: 336200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0066 with a magnetic layer
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/361 made of combinations of electrically conductive material and ferromagnetic material
• CPC Class Codes: H01F 27/363 made of electrically conductive material
• CPC Class Codes: H01F 27/366 made of ferromagnetic material

Abstract

A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.

Claims

1. A chip electronic component comprising:

a magnetic body including a resin and magnetic metal powder particles dispersed in the resin;

an insulating substrate disposed in the magnetic body;

an internal coil unit disposed on a surface of the insulating substrate, and embedded in and in direct contact with the magnetic body;

a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate which is cracked and includes a plurality of metal fragments; and

an external electrode connected to the internal coil unit, and disposed on a side surface of the magnetic body and a side surface of the cover unit, the external electrode extending from the side surface of the cover unit onto a surface of the cover unit which opposes another surface of the cover unit facing the magnetic body,

wherein the magnetic body is in direct contact with the surface of the insulating substrate, and

the external electrode is spaced apart from the magnetic metal plate.

2. The chip electronic component of claim 1, wherein spaces between the plurality of adjacent metal fragments are filled with a thermosetting resin.

3. The chip electronic component of claim 1, wherein adjacent metal fragments of the magnetic metal plate have shapes corresponding to each other.

4. The chip electronic component of claim 1, wherein an area of an upper surface or a lower surface of each of the plurality of metal fragments ranges from 0.0001 μ

m² to 40000 μ

m².

5. The chip electronic component of claim 1, wherein the plurality of metal fragments have regular shapes.

6. The chip electronic component of claim 1, wherein the plurality of metal fragments have irregular shapes.

7. The chip electronic component of claim 1, wherein the cover unit includes a thermosetting resin layer disposed on at least one of upper and lower surfaces of the magnetic metal plate.

8. The chip electronic component of claim 1, wherein surface roughness of the cover unit is 10 μ

m or less.

9. The chip electronic component of claim 1, wherein an average thickness of the magnetic metal plate ranges from 5 μ

m to 30 μ

m.

10. The chip electronic component of claim 1, wherein a thickness of the cover unit is equal to 5% to 50% of a thickness of the magnetic body.

11. The chip electronic component of claim 1, wherein the magnetic metal plate includes one or more selected from the group consisting of iron (Fe), silicon (Si), boron (B), chromium (Cr), aluminum (Al), copper (Cu), niobium (Nb), and nickel (Ni).

12. The chip electronic component of claim 1, wherein the cover unit includes the magnetic metal plate and a thermosetting resin layer disposed between the magnetic metal plate and the magnetic metal powder particles in the magnetic body, and

the thermosetting resin layer is in direct contact with the magnetic body.

13. The chip electronic component of claim 1, wherein the magnetic metal powder particles include first magnetic metal powder particles and second magnetic metal powder particles having average diameter less than that of the first magnetic metal powder particles.

14. The chip electronic component of claim 1, wherein the coil unit includes a first coil unit disposed on the surface of the insulating substrate and a second coil unit disposed on another surface of the insulating substrate opposing the surface of the insulating substrate, and

the first and second coil units are connected to each other through a via penetrating through the insulating substrate.

15. The chip electronic component of claim 1, wherein the cover unit includes a plurality of magnetic metal plates.

16. The chip electronic component of claim 15, wherein the cover unit includes a plurality of alternately stacked magnetic metal plates and thermosetting resin layers.

17. The chip electronic component of claim 16, wherein a thickness of each thermosetting resin layer is 1.5 to 2.0 times a thickness of each magnetic metal plate.

18. A chip electronic component comprising:

a magnetic body including a resin and magnetic metal powder particles dispersed in the resin;

an insulating substrate disposed in the magnetic body; and

an internal coil unit disposed on a surface of the insulating substrate, and embedded in and in direct contact with in the magnetic body, wherein;

a cover unit is disposed on at least one of upper and lower surfaces of the magnetic body,

an external electrode is connected to the internal coil unit and is disposed on a side surface of the magnetic body and a side surface of the cover unit, the external electrode extending from the side surface of the cover unit onto a surface of the cover unit which opposes another surface of the cover unit facing the magnetic body,

the cover unit has a magnetic permeability greater than that of the magnetic body,

the cover unit includes a magnetic metal plate and a thermosetting resin layer disposed on at least one of upper and lower surfaces of the magnetic metal plate,

the magnetic metal plate includes a plurality of metal fragments between which a thermosetting resin is interposed,

the magnetic body is in direct contact with the surface of the insulating substrate, and

the external electrode is spaced apart from the magnetic metal plate.

19. The chip electronic component of claim 18, wherein the thermosetting resin layer is in direct contact with the magnetic body.

20. A chip electronic component comprising:

a magnetic body including a resin and magnetic metal powder particles dispersed in the resin;

an insulating substrate disposed in the magnetic body;

an internal coil unit disposed on a surface of the insulating substrate, and embedded in and in direct contact with the magnetic body;

a cover unit covering a surface of the magnetic body and including thermosetting resin layers and a magnetic metal plate interposed therebetween; and

an external electrode connected to the internal coil unit, and disposed on a side surface of the magnetic body and a side surface of the cover unit, the external electrode extending from the side surface of the cover unit onto a surface of the cover unit which opposes another surface of the cover unit facing the magnetic body,

wherein the magnetic metal plate includes a plurality of metal fragments,

the magnetic body is in direct contact with the surface of the insulating substrate, and

the external electrode is spaced apart from the magnetic metal plate.

21. The chip electronic component of claim 20, wherein an area of an upper surface or a lower surface of each of the plurality of metal fragments ranges from 0.0001 μ

m² to 40000 μ

m².

22. The chip electronic component of claim 20, wherein the plurality of metal fragments are arranged in a lattice form.

23. The chip electronic component of claim 20, wherein the plurality of metal fragments have irregular shapes.

24. The chip electronic component of claim 20, wherein a thickness of each thermosetting resin layer is 1.5 to 2.0 times a thickness of the magnetic metal plate.

25. The chip electronic component of claim 20, wherein surface roughness of the cover unit is 10 μ

m or less.

26. The chip electronic component of claim 20, wherein an average thickness of the magnetic metal plate ranges from 5 μ

m to 30 μ

m.

27. The chip electronic component of claim 20, wherein a thickness of the cover unit is equal to 5% to 50% of a thickness of the magnetic body.

28. The chip electronic component of claim 20, the cover unit has a magnetic permeability greater than that of the magnetic body.

29. The chip electronic component of claim 20, wherein one of the thermosetting resin layers is disposed between magnetic metal plate and the magnetic body, and is in direct contact with the magnetic body.

30. The chip electronic component of claim 20, wherein a thermosetting resin is filled between adjacent metal fragments of the magnetic metal plate.

31. The chip electronic component of claim 30, wherein the thermosetting resin filled between the adjacent metal fragments is in direct contact with at least one of the thermosetting resin layers.

32. The chip electronic component of claim 30, wherein the thermosetting resin filled between the adjacent metal fragments directly connects the thermosetting resin layers to each other.