Electronic product and manufacturing method thereof

• US 10,716,219 B2
• Filed: 01/12/2018
• Issued: 07/14/2020
• Est. Priority Date: 01/26/2017
• Status: Active Grant

• Current Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation), Lite-On Technology Corporation
• Original Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Inventors: Pu, Yi-Feng, Lin, Tzu-Shu, Huang, Pei-Hsuan
• Primary Examiner(s): Willis, Tremesha S
• Application Number:
  US15/869,303
• Publication Number:
  US 20180213651A1
• Time in Patent Office: 914 Days
• Field of Search: 174260
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 69/02 of moulding techniques only
• CPC Class Codes: B29L 2031/3425 Printed circuits
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2203/0108 Male die used for patterning, punching or transferring
• CPC Class Codes: H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/085 Using vacuum or low pressure
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/178 Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
• CPC Class Codes: H05K 3/0011 Working of insulating substrates or insulating layers
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

Claims

1. A manufacturing method of an electronic product, comprising:

forming a conductive circuit on a film by a hot stamping process, wherein the conductive circuit is made by a metal foil, a part of the metal foil is pressed and fixed to the film so as to pattern the metal foil as a conductive metal layer to form the conductive circuit, wherein a heat resistant releasing layer is disposed on the conductive metal layer and separates the conductive metal layer and a press plate, and a part of the metal foil not pressed and fixed to the film is removed by peeling off the heat resistant releasing layer;

disposing an electronic element on the conductive circuit of the film, wherein the electronic element is electrically connected to the conductive circuit; and

combining the film and a supporting structure by an out-mold molding technology or an in-mold molding technology, such that the electronic element is wrapped between the film and the supporting structure.

2. The manufacturing method according to claim 1, wherein the out-mold molding technology comprises an out-mold wrapping method, a high temperature vacuum adsorption method, a hot pressing method, a ultrasonic melting method, a melt bonding method or an adhesive bonding method, and the in-mold molding technology comprises an injection molding method.

3. The manufacturing method according to claim 1, wherein the film is a polymer film, and forming the conductive circuit comprises:

forming a patterned ink layer having a circuit pattern on the polymer film;

placing the conductive metal layer on the patterned ink layer; and

hot pressing the conductive metal layer on the patterned ink layer.

4. The manufacturing method according to claim 3, further comprising disposing the conductive metal layer having the heat resistant releasing layer on the patterned ink layer.

5. The manufacturing method according to claim 1, wherein the film is a polymer film, and forming the conductive circuit comprises:

placing the conductive metal layer on a toppan stamping plate, wherein a protrusion of the toppan stamping plate forms a circuit pattern, and the conductive metal layer contains a binder;

placing the polymer film on the conductive metal layer; and

hot pressing the conductive metal layer through the toppan stamping plate on the polymer film.

6. The manufacturing method according to claim 5, further comprising

disposing the conductive metal layer having the heat resistant releasing layer on the toppan stamping plate.

7. The manufacturing method according to claim 1, wherein the film is a polymer film, and forming the conductive circuit comprises:

placing the conductive metal layer having a circuit pattern on the polymer film, wherein the conductive metal layer has a binder; and

hot pressing the conductive metal layer on the polymer film.

8. A manufacturing method of an electronic product, comprising:

forming a conductive circuit on a film by a cold stamping process, wherein the conductive circuit is made by a metal foil, a part of the metal foil is pressed and fixed to the film so as to pattern the metal foil as a conductive metal layer to form the conductive circuit, wherein a light resistant releasing layer is disposed on the conductive metal layer and separates the conductive metal layer and a press plate, and a part of the metal foil not pressed and fixed to the film is removed by peeling off the light resistant releasing layer;

disposing an electronic element on the conductive circuit of the film, wherein the electronic element is electrically connected to the conductive circuit; and

combining the film and a supporting structure by an out-mold molding technology or an in-mold molding technology, such that the electronic element is wrapped between the film and the supporting structure.

9. The manufacturing method according to claim 8, wherein the out-mold molding technology comprises an out-mold wrapping method, a high temperature vacuum adsorption method, a hot pressing method, a ultrasonic melting method, a melt bonding method or an adhesive bonding method, and the in-mold molding technology comprises an injection molding method.

10. The manufacturing method according to claim 8, wherein the film is a polymer film, and forming the conductive circuit comprises:

forming a patterned binder layer having a circuit pattern on the polymer film;

placing the conductive metal layer on the patterned binder layer; and

applying a pressure to the conductive metal layer on the patterned binder layer, and curing the patterned binder to form a patterned conductive metal layer having the circuit pattern on the polymer film.

11. The manufacturing method according to claim 8, wherein the film is a polymer film, and forming the conductive circuit comprises:

forming a patterned binder layer on a protrusion of a toppan or a groove of an intaglio plate, wherein the protrusion of the toppan or the groove of the intaglio plate forms a circuit pattern;

placing the polymer film on the patterned binder and transfer-printing the patterned binder layer on the polymer film;

placing the conductive metal layer on the patterned binder layer; and

applying a pressure to the conductive metal layer on the patterned binder layer, and curing the patterned binder layer to form a patterned conductive metal layer having the circuit pattern on the polymer film.

12. The manufacturing method according to claim 10, further comprising:

disposing the conductive metal layer having the light resistant releasing layer on the patterned binder layer.

13. The manufacturing method according to claim 11, further comprising:

disposing the conductive metal layer having the light resistant releasing layer on the patterned binder layer.