Method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated thereby
First Claim
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1. A method of measuring misalignment of chips in a substrate, comprising:
- obtaining images by scanning the substrate and the chips, the chips being arranged in first and second directions in the substrate, the chips including first to n-th chips arranged in the first direction and the second direction, the second direction crossing the first direction;
selecting one of the first and second directions as a selected direction;
setting the k-th chips in the selected direction as reference chips, k being an integer greater than or equal to 1 and less than or equal to n;
setting remaining chips in the selected direction as subordinate chips, the subordinate chips and the reference chips being different from each other among the first to n-th chips arranged in the selected direction;
obtaining absolute offsets of the reference chips with respect to the substrate in the images;
obtaining relative offsets of the subordinate chips with respect to the reference chips in the images; and
calculating misalignments of the subordinate chips by summing the absolute offsets and the relative offsets.
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Abstract
A method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated thereby are provided. The measuring method may include obtaining images by scanning chips on a substrate, obtaining absolute offsets of reference chips with respect to the substrate in the images, obtaining relative offsets of subordinate chips with respect to the reference chips in the images, and calculating misalignments of the chips based on the absolute offsets and the relative offsets.
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20 Claims
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1. A method of measuring misalignment of chips in a substrate, comprising:
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obtaining images by scanning the substrate and the chips, the chips being arranged in first and second directions in the substrate, the chips including first to n-th chips arranged in the first direction and the second direction, the second direction crossing the first direction; selecting one of the first and second directions as a selected direction; setting the k-th chips in the selected direction as reference chips, k being an integer greater than or equal to 1 and less than or equal to n; setting remaining chips in the selected direction as subordinate chips, the subordinate chips and the reference chips being different from each other among the first to n-th chips arranged in the selected direction; obtaining absolute offsets of the reference chips with respect to the substrate in the images; obtaining relative offsets of the subordinate chips with respect to the reference chips in the images; and calculating misalignments of the subordinate chips by summing the absolute offsets and the relative offsets. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification