Thermopile module

  • US 10,732,049 B2
  • Filed: 09/27/2018
  • Issued: 08/04/2020
  • Est. Priority Date: 03/20/2015
  • Status: Active Grant
First Claim
Patent Images

1. An electronic device, comprising:

  • an outer case having an opening;

    a circuit substrate disposed inside the outer case;

    a thermopile sensor chip disposed on the circuit substrate;

    a filter structure disposed above the thermopile sensor chip; and

    a waterproof structure surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case.

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