Thermopile module
First Claim
Patent Images
1. An electronic device, comprising:
- an outer case having an opening;
a circuit substrate disposed inside the outer case;
a thermopile sensor chip disposed on the circuit substrate;
a filter structure disposed above the thermopile sensor chip; and
a waterproof structure surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case.
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Abstract
An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
2 Citations
17 Claims
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1. An electronic device, comprising:
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an outer case having an opening; a circuit substrate disposed inside the outer case; a thermopile sensor chip disposed on the circuit substrate; a filter structure disposed above the thermopile sensor chip; and a waterproof structure surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic device, comprising:
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an outer case having an opening; a circuit substrate disposed inside the outer case; a thermopile sensor chip disposed on the circuit substrate; and a waterproof structure disposed on the outer case for sealing up the opening of the outer case. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification