Electrically-isolated and moisture-resistant designs for wearable devices
First Claim
1. A wearable device comprising:
- a printed circuit board (“
PCB”
) having first and second outer layers and an inner layer, the inner layer disposed between the first and second outer layers;
a semiconductor package having a plurality of electrical conductors, the semiconductor package coupled to the first outer layer of the PCB using the plurality of electrical conductors;
an electrical contact formed on the second outer layer of the PCB;
a trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the trace having a first end coupled to a first electrical conductor of the plurality of electrical conductors and a second end coupled to the electrical contact; and
an encapsulant disposed around a perimeter of the semiconductor package, the encapsulant covering (i) the plurality of electrical conductors, (ii) the first portion of the trace, (iii) the third portion of the trace, wherein an upper surface of the semiconductor package remains exposed.
2 Assignments
0 Petitions
Accused Products
Abstract
An example continuous glucose monitor includes a printed circuit board (“PCB”) having first and second outer layers and an inner layer; a semiconductor package having a plurality of pins coupled to the first outer layer of the PCB; an electrical contact formed on the second outer layer of the PCB; a trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the trace having a first end coupled to a first pin of the plurality of pins and a second end coupled to the electrical contact; and an encapsulant disposed around a perimeter of the semiconductor package, the encapsulant covering the plurality of pins, the first portion of the sensor trace, the third portion of the sensor trace, wherein an upper surface of the semiconductor package remains exposed.
22 Citations
13 Claims
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1. A wearable device comprising:
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a printed circuit board (“
PCB”
) having first and second outer layers and an inner layer, the inner layer disposed between the first and second outer layers;a semiconductor package having a plurality of electrical conductors, the semiconductor package coupled to the first outer layer of the PCB using the plurality of electrical conductors; an electrical contact formed on the second outer layer of the PCB; a trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the trace having a first end coupled to a first electrical conductor of the plurality of electrical conductors and a second end coupled to the electrical contact; and an encapsulant disposed around a perimeter of the semiconductor package, the encapsulant covering (i) the plurality of electrical conductors, (ii) the first portion of the trace, (iii) the third portion of the trace, wherein an upper surface of the semiconductor package remains exposed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A wearable device comprising:
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a printed circuit board (“
PCB”
) having first and second outer layers and an inner layer, the inner layer disposed between the first and second outer layers;a semiconductor package having a plurality of electrical conductors, the semiconductor package coupled to the first outer layer of the PCB using the plurality of electrical conductors; an electrical ground plane formed on the PCB and coupled to a subset of the plurality of electrical conductors and not coupled to any electrical conductors at a first corner portion of the semiconductor package; an electrical contact formed on the second outer layer of the PCB; a trace having a first portion disposed on the first outer layer, a second portion disposed on the inner layer, and a third portion disposed on the second outer layer, the trace having a first end coupled to a first electrical conductor of the plurality of electrical conductors and a second end coupled to the electrical contact, the first electrical conductor at the first corner portion of the semiconductor package; and a plurality of guard rings disposed on the PCB, each guard ring of the plurality of guard rings encircling a respective one of the portions of the trace. - View Dependent Claims (11, 12, 13)
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Specification