Electronic device display with array of discrete light-emitting diodes

• US 10,739,882 B2
• Filed: 08/06/2014
• Issued: 08/11/2020
• Est. Priority Date: 08/06/2014
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Chen, Wei, Hotelling, Steven P., Zhong, John Z., Athas, William C., Yao, Wei H.
• Primary Examiner(s): Patel, Premal R
• Application Number:
  US14/453,574
• Publication Number:
  US 20160041663A1
• Time in Patent Office: 2,197 Days
• CPC Class Codes: G06F 2203/04102 Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: G09G 2360/14 Detecting light within display terminals, e.g. using a single or a plurality of photosensors
• CPC Class Codes: G09G 3/03 specially adapted for displays having non-planar surfaces, e.g. curved displays
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H04N 9/30 using solid-state colour display devices

Abstract

An electronic device may include a display. The display may be formed by an array of light-emitting diodes mounted to the surface of a substrate. The substrate may be a silicon substrate. Circuitry may be located in spaces between the light-emitting diodes. Circuitry may also be located on the rear surface of the silicon substrate and may be coupled to the array of light-emitting diodes using through-silicon vias. The circuitry may include integrated circuits and other components that are attached to the substrate and may include transistors and other circuitry formed within the silicon substrate. Touch sensor electrodes, light sensors, and other components may be located in the spaces between the light-emitting diodes. The substrate may be formed from a transparent material that allows image light to reach a lens and image sensor mounted below the substrate.

Claims

1. A display, comprising:

a semiconductor substrate having opposing first and second surfaces;

circuitry formed at least partially within the semiconductor substrate;

an array of light-emitting diodes mounted on the first surface of the semiconductor substrate; and

a touch sensor formed from capacitive touch sensor electrodes that are located in spaces between the light-emitting diodes.

2. The display defined in claim 1 wherein the semiconductor substrate comprises a silicon substrate, the display further comprising:

through-silicon vias that pass through the silicon substrate.

3. The display defined in claim 2 further comprising display control circuitry on the second surface that controls the array of light-emitting diodes using signals that pass through the through-silicon vias.

4. The display defined in claim 1 wherein the semiconductor substrate is non-transparent.