Camera module for vehicle
First Claim
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1. A camera module, comprising:
- a first PCB (printed circuit board);
a second PCB spaced apart from the first PCB;
a lens module disposed over the first PCB; and
an outer shield supporting the first PCB and the second PCB;
wherein the first PCB has a first PCB protrusion supported by the outer shield,wherein the second PCB has a second PCB protrusion supported by the outer shield,wherein the outer shield comprises a sidewall, a first hole formed through the sidewall, a second hole formed through the sidewall directly below the first hole, a first tension spring bent from the sidewall and extending into the first hole, and a second tension spring bent from the sidewall and extending into the second hole,wherein the first tension spring and the second tension spring are monolithically formed with the sidewall,wherein at least a portion of the first PCB protrusion is disposed in the first hole, andwherein at least a portion of the second PCB protrusion is disposed in the second hole.
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Abstract
A camera module for a vehicle according to the present invention includes a first Printed Circuit Board (PCB) configured to have an image sensor mounted on its surface; a second PCB configured to supply a power source to the first PCB; an outer shield installed to surround the side of the first and the second PCBs and to shield the first and the second PCBs from electromagnetic interference (EMI); and a plurality of support units disposed at positions where the supports units interfere with the first and the second PCBs of the outer shield and configured to support the first and the second PCBs.
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10 Claims
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1. A camera module, comprising:
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a first PCB (printed circuit board); a second PCB spaced apart from the first PCB; a lens module disposed over the first PCB; and an outer shield supporting the first PCB and the second PCB; wherein the first PCB has a first PCB protrusion supported by the outer shield, wherein the second PCB has a second PCB protrusion supported by the outer shield, wherein the outer shield comprises a sidewall, a first hole formed through the sidewall, a second hole formed through the sidewall directly below the first hole, a first tension spring bent from the sidewall and extending into the first hole, and a second tension spring bent from the sidewall and extending into the second hole, wherein the first tension spring and the second tension spring are monolithically formed with the sidewall, wherein at least a portion of the first PCB protrusion is disposed in the first hole, and wherein at least a portion of the second PCB protrusion is disposed in the second hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification