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Low dielectric constant (DK) and dissipation factor (DF) material for nano-molding technology (NMT)

  • US 10,752,771 B2
  • Filed: 12/28/2018
  • Issued: 08/25/2020
  • Est. Priority Date: 12/29/2017
  • Status: Active Grant
First Claim
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1. A thermoplastic composition comprising:

  • from 15 wt. % to 80 wt. % of a polymer resin; and

    from 10 wt. % to 50 wt. % of a low dielectric constant glass fiber component, wherein the glass fiber component has a Dk of less than 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than 0.002 at a frequency of from 1 MHz to 1 GHz;

    from 3 wt. % to 40 wt. % of a hollow filler; and

    from 0.1 wt. % to 10 wt. % of an impact modifier,wherein the thermoplastic composition exhibits a dielectric constant of less than 3.2 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness;

    wherein the thermoplastic composition exhibits a dissipation factor Df of less than 0.01 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness,wherein the thermoplastic composition exhibits a nano-molding technology bonding strength of at least 18 MPa when tested in accordance with a bonding strength test adapted from ISO 19095 with a T treatment,wherein the thermoplastic composition exhibits a notched impact strength of at least 70 J/m when tested in accordance with ASTM D256 at 23°

    C.,wherein the thermoplastic composition exhibits a flow rate of less than 25 cm3/10 min when tested in accordance with ISO 1133 at 275°

    C. at 5 kg and 300 seconds, andwherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.

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