Techniques for device attachment with dual band imaging sensor
First Claim
Patent Images
1. A device, comprising:
- a thermal imaging module having a first side and a second side opposite the first side;
a non-thermal imaging module;
a circuit board, wherein the thermal imaging module is disposed such that the first side is within a socket secured to the circuit board; and
a bridge coupled to and extending between the thermal imaging module and the non-thermal imaging module, wherein the bridge comprises at least one fixturing element that engages a portion of the non-thermal imaging module and contacts a surface of the circuit board to support the non-thermal imaging module, wherein the bridge is coupled to the second side and configured to maintain a position of the thermal imaging module relative to the non-thermal imaging module to maintain alignment between the thermal imaging module and the non-thermal imaging module.
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Abstract
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.
244 Citations
20 Claims
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1. A device, comprising:
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a thermal imaging module having a first side and a second side opposite the first side; a non-thermal imaging module; a circuit board, wherein the thermal imaging module is disposed such that the first side is within a socket secured to the circuit board; and a bridge coupled to and extending between the thermal imaging module and the non-thermal imaging module, wherein the bridge comprises at least one fixturing element that engages a portion of the non-thermal imaging module and contacts a surface of the circuit board to support the non-thermal imaging module, wherein the bridge is coupled to the second side and configured to maintain a position of the thermal imaging module relative to the non-thermal imaging module to maintain alignment between the thermal imaging module and the non-thermal imaging module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 16, 19, 20)
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9. A device, comprising:
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a thermal imaging module comprising an infrared sensor assembly; and a switch assembly comprising a slider plate and a slider button provided on the slider plate, wherein the switch assembly is configured to switch on and off the device and further configured to control the slider plate configured to block external infrared energy from being received by the infrared sensor assembly, wherein, via movement of the slider button, the switch assembly comprises; a first switch position that positions the slider plate to switch off the device; a second switch position that positions the slider plate to switch on the device; and a third switch position that positions at least a portion of the slider plate to block the external infrared energy from being received by the infrared sensor assembly while the device is switched on. - View Dependent Claims (10, 11, 12, 17)
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13. A method, comprising:
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providing a thermal imaging module comprising an infrared sensor assembly; and providing a switch assembly comprising a slider plate and a slider button provided on the slider plate, wherein the switch assembly is configured to switch on and off the thermal imaging module and further configured to control the slider plate to selectively block external infrared energy from being received by the infrared sensor assembly, wherein, via movement of the slider button, the switch assembly comprises; a first switch position that positions the slider plate to switch off a device that includes the thermal imaging module; a second switch position that positions the slider plate to switch on the device; and a third switch position that positions at least a portion of the slider plate to block the external infrared energy from being received by the infrared sensor assembly while the device is switched on. - View Dependent Claims (14, 15, 18)
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Specification