Methods of preparing articles by electrodeposition and additive manufacturing processes

• US 10,781,524 B2
• Filed: 03/20/2017
• Issued: 09/22/2020
• Est. Priority Date: 09/18/2014
• Status: Active Grant

• Current Assignee: Modumetal Incorporated
• Original Assignee: Modumetal Incorporated
• Inventors: Whitaker, John D., Caldwell, Richard J., Jennings, Chad
• Primary Examiner(s): Polley, Christopher M
• Application Number:
  US15/464,224
• Publication Number:
  US 20170191177A1
• Time in Patent Office: 1,282 Days
• Field of Search: None
• CPC Class Codes: B22F 10/12 by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
• CPC Class Codes: B22F 10/18 by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
• CPC Class Codes: B22F 10/20 Direct sintering or melting
• CPC Class Codes: B22F 10/28 Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
• CPC Class Codes: B22F 2003/242 Coating
• CPC Class Codes: B22F 2007/042 characterised by the layer forming method
• CPC Class Codes: B22F 2998/10 Processes characterised by the sequence of their steps
• CPC Class Codes: B22F 3/24 After-treatment of workpieces or articles B22F3/1146 takes precedence
• CPC Class Codes: B22F 7/04 with one or more layers not made from powder, e.g. made from solid metal
• CPC Class Codes: B23K 26/342 Build-up welding
• CPC Class Codes: B23K 26/70 Auxiliary operations or equipment
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: C23C 18/1641 Organic substrates, e.g. resin, plastic
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/1657 Electroless forming, i.e. substrate removed or destroyed at the end of the process
• CPC Class Codes: C23C 18/1666 Ultrasonics
• CPC Class Codes: C23C 18/1689 After-treatment
• CPC Class Codes: C23C 18/24 using acid aqueous solutions
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C25D 1/00 : Electroforming
• CPC Class Codes: C25D 1/003 : 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 1/20 : Separation of the formed objects from the electrodes with no destruction of said electrodes
• CPC Class Codes: C25D 17/007 : Current directing devices
• CPC Class Codes: C25D 17/008 : Current shielding devices
• CPC Class Codes: C25D 17/12 : Shape or form C25D17/14 takes precedence
• CPC Class Codes: C25D 21/10 : Agitating of electrolytes; Moving of racks
• CPC Class Codes: C25D 3/12 : of nickel or cobalt
• CPC Class Codes: C25D 5/022 : using masking means
• CPC Class Codes: C25D 5/08 : Electroplating with moving electrolyte e.g. jet electroplating using locally applied jets of electrolyte C25D5/026
• CPC Class Codes: C25D 5/10 : Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 : at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/14 : two or more layers being of nickel or chromium, e.g. duplex or triplex layers
• CPC Class Codes: C25D 5/18 : Electroplating using modulated, pulsed or reversing current
• CPC Class Codes: C25D 5/56 : of plastics
• CPC Class Codes: C25D 5/617 : Crystalline layers
• CPC Class Codes: C25D 5/619 : Amorphous layers
• CPC Class Codes: C25D 5/627 : Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
• CPC Class Codes: Y02P 10/25 : Process efficiency

Abstract

Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

Claims

1. A method of forming an article with an electrodeposited coating, the method comprising:

preparing an electroplatable assembly by an additive manufacturing method selected from the group consisting of three-dimensional printing, selective laser sintering, sintering laser melting, fused deposition modeling, and stereolithography, the electroplatable assembly comprising a preform for the article and a thief and/or a shield, which are joined by direct contact or by respective sections of framework, wherein the preform and the thief and/or the shield are oriented relative to each other; and

forming the electrodeposited coating on at least a portion of a surface of the preform by electrodepositing a composition comprising one or more elements onto the preform.

2. The method of claim 1, wherein the electrodepositing the composition comprises contacting at least a portion of the electroplatable assembly with an electrolyte comprising one or more electroplatable species of metal ions.

3. The method of claim 2, wherein the contacting at least the portion of the electroplatable assembly with the electrolyte comprises flowing the electrolyte over or against at least the portion of the surface of the preform.

4. The method of claim 3, wherein the flowing comprises:

agitation;

pumping electrolyte through one or more non-conductive tubes;

or

pumping the electrolyte through one or more passages within a section of framework of the respective sections of framework and/or the shield.

5. The method of claim 3, wherein the article produced has a percent thickness variation (PTV) that is less than 100%.

6. The method of claim 1, wherein one or more of the preform, a section of framework of the respective sections of framework, the thief, or the shield comprises a non-conductive material.

7. The method of claim 6, wherein the preform the section of framework, and/or the thief is subject to electroless plating prior to the electrodepositing of the composition onto the preform.

8. The method of claim 7, wherein the non-conductive material is a polymer.

9. The method of claim 8, wherein the polymer comprises:

polyetherimide, polyetherketoneketone (PEKK), polyether ether ketone (PEEK), nylon, polyvinyl alcohol (PVA), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polylactic acid (PLA), PC/ABS, wood fiber, polyphenylsulfone (PPSU) or a combination thereof.

10. The method of claim 6, wherein the preform and/or the thief comprise the non-conductive material, and wherein the non-conductive material incorporates a catalyst for electroless plating.

11. The method of claim 1, wherein one or more of the preform, a section of the respective sections of framework, or the thief comprises a conductive material that comprises:

one or more metals;

a non-conductive polymer and one or more metals, graphite particles, graphite fibers, metal plated graphite particles or metal plated carbon fibers;

a conductive polymer and one or more metals, graphite particles, graphite fibers, metal plated graphite particles, or metal plated carbon fibers;

or

a conductive polymer.

12. The method according to claim 1, wherein the electrodeposited coating comprises a structurally and/or compositionally modulated material that comprises a plurality of layers with wavelengths between about 1 nm and about 250 nm.

13. The method of claim 1, wherein the electrodeposited coating comprises a plurality of first layers and second layers arranged as alternating first and second layers.

14. The method of claim 13, wherein the plurality of alternating first layers and second layers comprises four or more alternating first and second layers.

15. The method of claim 1, further comprising separating the article from the respective sections of framework, the thief, and the shield following the electrodepositing.

16. The method of claim 1, wherein preparing the electroplatable assembly comprises:

preparing the preform for the article, the thief and/or the shield;

wherein the preform, the thief, and/or the shield is prepared by the additive manufacturing method;

wherein the preform, the thief, and/or the shield each comprise a mating interface that permits assembly of the preform with the thief and/or the shield into the electroplatable assembly in which the preform is oriented relative to the thief and/or the shield; and

forming the electroplatable assembly comprising joining the preform and the thief and/or the shield to each other and/or to the respective sections of framework, which comprise corresponding mating interfaces that correspond to the mating interfaces, wherein the preform is oriented relative to the thief and/or the shield, which are oriented with respect to each other in the electroplatable assembly.

17. The method of claim 16, wherein preparing the electroplatable assembly comprises:

preparing a preform-thieve-assembly in which the preform is joined and oriented relative to the thief by the respective sections of framework, wherein the preform-thieve-assembly comprises the mating interface;

preparing the shield which comprises an additional mating interface; and

forming the electroplatable assembly comprising joining the preform-thieve-assembly and the shield to each other and/or to the respective sections of framework.

18. The method of claim 16, wherein preparing the electroplatable assembly comprises:

preparing a preform-shield-assembly in which the preform is joined and oriented relative to the shield by a section of the respective sections of framework, wherein the preform-shield-assembly comprises the mating interface;

preparing the thief which comprises an additional mating interface; and

forming the electroplatable assembly comprising joining the preform-shield-assembly and the thief to each other and/or to the respective sections of framework.

19. The method of claim 13, wherein the electrodeposited coating further comprises one or more additional layers between a first layer and a second layer of the plurality of alternating first and second layers.

20. The method of claim 1, wherein the electroplatable assembly comprises:

a plurality of thieves that comprises the thief; and

/or

a plurality of shields that comprises the shield,

wherein the preform and each thief of the plurality of thieves and/or each shield of the plurality of shields is oriented relative to each other.