Induction type power supply system and coil module thereof

• US 10,784,042 B2
• Filed: 03/06/2019
• Issued: 09/22/2020
• Est. Priority Date: 02/11/2015
• Status: Active Grant

• Current Assignee: Fu Da Tong Technology Co., Ltd.
• Original Assignee: Fu Da Tong Technology Co., Ltd.
• Inventors: Tsai, Ming-Chiu, Chan, Chi-Che
• Primary Examiner(s): Hinson, Ronald
• Application Number:
  US16/294,858
• Publication Number:
  US 20190206616A1
• Time in Patent Office: 566 Days
• Field of Search: 336220, 336200
• CPC Class Codes: H01F 2038/143 for signals
• CPC Class Codes: H01F 27/2823 Wires H01F27/2866 takes precedence
• CPC Class Codes: H01F 27/2871 Pancake coils
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction

Abstract

A coil module for an induction type power supply system includes a supporting frame, an upper lid and a first wire. The upper lid, disposed on the supporting frame, includes a spiral slot. The first wire is used for being inserted in the spiral slot to form a coil.

Claims

1. A coil module for an induction type power supply system comprising:

a supporting frame;

an upper lid, disposed on the supporting frame, the upper lid comprising a spiral slot, wherein the spiral slot has a plurality of layers; and

a first wire, for being inserted in the spiral slot to form a coil;

wherein an opening is disposed between the N^th layer and the (N+1)^th layer among the plurality of layers of the spiral slot, and N is a positive integer.

2. The coil module of claim 1, wherein the first wire is disposed by entering the (N+1)^th layer from the N^th layer via the opening without entirely filling the N^th layer.

3. The coil module of claim 1, wherein a shape of the spiral slot is disposed following a shape of the upper lid.

4. The coil module of claim 1, wherein the first wire and a second wire insulated from the first wire are disposed in the spiral slot, and operations of signal modulation or demodulation are performed on one of the first wire and the second wire, while the other wire transmits power without performing the operations of signal modulation or demodulation.

5. The coil module of claim 1, wherein the density of wire in a middle part of the coil is lower than the density of wire near two terminals of the coil.