Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

• US 10,791,631 B2
• Filed: 11/29/2017
• Issued: 09/29/2020
• Est. Priority Date: 12/06/2016
• Status: Active Grant

• Current Assignee: JX Nippon Mining & Metals Corporation (ENEOS Holdings, Inc.)
• Original Assignee: JX Nippon Mining & Metals Corporation (ENEOS Holdings, Inc.)
• Inventors: Ori, Yuki, Arai, Hideta, Miki, Atsushi, Fukuchi, Ryo
• Primary Examiner(s): Dumbris, Seth
• Application Number:
  US15/825,259
• Publication Number:
  US 20180160546A1
• Time in Patent Office: 1,035 Days
• Field of Search: None
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2203/0376 Etching temporary metallic carrier substrate
• CPC Class Codes: H05K 2203/0392 Pretreatment of metal, e.g. before finish plating, etching improvement of the adhesion between an insulating substrate and a metal by special treatment of the metal H05K3/382
• CPC Class Codes: H05K 2203/072 Electroless plating, e.g. finish plating or initial plating
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/382 by special treatment of the metal
• CPC Class Codes: H05K 3/46 Manufacturing multilayer circuits
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387
• CPC Class Codes: Y10T 428/12431 Foil or filament smaller than 6 mils

Abstract

Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed.

Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference ΔE*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.

Claims

1. A surface treated copper foil, comprising

a copper foil, and

a roughening treatment layer on at least one surface of the copper foil, wherein

a height of roughening particles of the roughening treatment layer is 5 nm to 1000 nm from the surface of the copper foil,

a color difference Δ

E*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and

a glossiness of a TD of the surface of the side of the roughening treatment layer is 70% or less.

2. The surface treated copper foil according to claim 1, wherein the height of the roughening particles of the roughening treatment layer is 20 nm to 1000 nm from the surface of the copper foil.

3. The surface treated copper foil according to claim 1, wherein the height of the roughening particles of the roughening treatment layer is 150 nm to 1000 nm from the surface of the copper foil.

4. The surface treated copper foil according to claim 1, wherein the height of the roughening particles of the roughening treatment layer is 5 nm to 650 nm from the surface of the copper foil.

5. The surface treated copper foil according to claim 1, wherein the height of the roughening particles of the roughening treatment layer is 5 nm to 150 nm from the surface of the copper foil.

6. The surface treated copper foil according to claim 1, wherein a thickness of the roughening particles of the roughening treatment layer is 5 nm to 500 nm.

7. The surface treated copper foil according to claim 1, wherein a thickness of the roughening particles of the roughening treatment layer is 10 nm or more.

8. The surface treated copper foil according to claim 1, wherein a thickness of the roughening particles of the roughening treatment layer is 250 nm or less.

9. The surface treated copper foil according to claim 1, wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 65% or less.

10. The surface treated copper foil according to claim 1, wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 10% or less.

11. The surface treated copper foil according to claim 1, wherein the glossiness of the TD of the surface of the side of the roughening treatment layer is 5% or less.

12. The surface treated copper foil according to claim 1, wherein the color difference Δ

E*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 42 to 65.

13. The surface treated copper foil according to claim 1, wherein the color difference Δ

E*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 45 to 65.

14. The surface treated copper foil according to claim 1, wherein the color difference Δ

E*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65.

15. The surface treated copper foil according to claim 1, wherein the color difference Δ

E*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 50 or less.

16. The surface treated copper foil according to claim 1, wherein

the height of roughening particles of the roughening treatment layer is 500 nm to 1000 nm from the surface of the copper foil,

the thickness of the roughening particles of the roughening treatment layer is 10 nm to 250 nm,

the color difference Δ

E*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65, and

the glossiness of the TD of the surface of the side of the roughening treatment layer is 5% or less.

17. The surface treated copper foil according to claim 1, wherein

the height of roughening particles of the roughening treatment layer is 20 nm to 400 nm from the surface of the copper foil,

the thickness of the roughening particles of the roughening treatment layer is 10 nm to 250 nm,

the color difference Δ

E*ab according to JIS Z 8730 of the surface of the side of the roughening treatment layer is 49.1 to 65, and

the glossiness of the TD of the surface of the side of the roughening treatment layer is 65% or less.

18. The surface treated copper foil according to claim 1, wherein the copper foil has the roughening treatment layer on both surfaces of the copper foil.

19. The surface treated copper foil according to claim 1 comprising, on the surface of the roughening treated layer, one or more layers selected from the group consisting of a heat resistant layer, a rust preventive layer, a chromate treatment layer and a silane coupling treatment layer.

20. The surface treated copper foil according to claim 1, wherein the surface treated copper foil is for heat dissipation.

21. A surface treated copper foil with resin layer, comprising the surface treated copper foil according to claim 1, and a resin layer on the surface of the side of the roughening treatment layer.

22. A copper foil with carrier, comprising

a carrier,

an intermediate layer, and

an ultra-thin copper layer,

wherein the ultra-thin copper layer is the surface treated copper foil according to claim 1.

23. The copper foil with carrier, comprising

a carrier,

an intermediate layer, and

an ultra-thin copper layer,

wherein the ultra-thin copper layer is the surface treated copper foil with resin layer according to claim 21.

24. A laminate, comprising the surface treated copper foil according to claim 1.

25. A laminate, comprising the copper foil with carrier according to claim 22.