Wear-out monitor device

• US 10,794,950 B2
• Filed: 07/16/2019
• Issued: 10/06/2020
• Est. Priority Date: 04/19/2016
• Status: Active Grant

• Current Assignee: Analog Devices Global Unlimited Company (Analog Devices, Inc.)
• Original Assignee: Analog Devices, Inc.
• Inventors: Coyne, Edward John, O'Donnell, Alan J., Bradley, Shaun, Aherne, David, Boland, David, O'Dwyer, Thomas G., Heffernan, Colm Patrick, Manning, Kevin B., Forde, Mark, Clarke, David J., Looby, Michael A.
• Primary Examiner(s): Hoque, Farhana A
• Application Number:
  US16/513,562
• Publication Number:
  US 20190361071A1
• Time in Patent Office: 448 Days
• Field of Search: 32476201, 361 18
• CPC Class Codes: G01N 27/041 of a solid body
• CPC Class Codes: G01R 31/2874 related to temperature
• CPC Class Codes: G01R 31/2879 related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads

Abstract

The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.

Claims

1. An integrated circuit device comprising a monitor device comprising a plurality of monitor structures each comprising a reservoir and a corresponding diffusion region into which a diffusant from the reservoir diffuses, wherein different ones of the monitor structures are configured differently to record indications of an exposure of a core circuit to different stress conditions by diffusing respective diffusants at different diffusion rates.

2. The integrated circuit device of claim 1, wherein the differently configured monitor structures comprise differently configured reservoirs each containing a respective diffusant.

3. The integrated circuit device of claim 1, further comprising a sensing circuit electrically connected to the monitor device and configured to detect an electrical property that changes in response to diffusing one or more of the diffusants.

4. The integrated circuit device of claim 1, wherein the monitor device is integrated on a same substrate as the core circuit.

5. The integrated circuit device of claim 1, wherein one or more of the diffusants have a diffusion activation energy between 0.75 eV and 2.5 eV.

6. The integrated circuit device of claim 1, wherein one or more of the diffusants comprise one or more elements selected from the group consisting of aluminum (Al), cobalt (Co), platinum (Pt), sulfur (S), nickel (Ni), silver (Ag), zinc (Zn), gold (Au), chromium (Cr), copper (Cu), iron (Fe), sodium (Na) and potassium (K).

7. The integrated circuit device of claim 1, wherein one or more of the differently configured monitor structures are configured to initiate recording the indications of the exposure of the core circuit in response to activation by a stimulus.

8. The integrated circuit device of claim 1, wherein each of the differently configured monitor structures further comprises a diffusion barrier disposed between the reservoir containing the diffusant and the diffusion region, wherein the diffusion barrier is configured such that the diffusant diffuses through the diffusion barrier in response to activation by a stimulus.

9. The integrated circuit device of claim 8, wherein the diffusant has a diffusion activation energy in the diffusion barrier that is higher than a diffusion activation energy of the diffusant in the diffusion region.

10. The integrated circuit device of claim 1, wherein the indications of the exposure of the core circuit comprise a concentration profile of one or more of the diffusants in respective ones of the diffusion regions.

11. An integrated circuit device comprising a monitor device configured to record an indication of an exposure of a core circuit to a stress condition without being powered, wherein the monitor device comprises a reservoir and a diffusion region into which a diffusant from the reservoir diffuses and is configured to initiate recording the indication of the exposure by diffusing the diffusant through a diffusion barrier into the diffusion region in response to an applied stimulus.

12. The integrated circuit device of claim 11, wherein the diffusion barrier is formed of a different material from the diffusion region.

13. The integrated circuit device of claim 11, wherein the diffusant has a diffusion activation energy between 0.75 eV and 2.5 eV in the diffusion region.

14. The integrated circuit device of claim 13, wherein the diffusant has a diffusion activation energy in the diffusion barrier that is higher than the diffusion activation energy of the diffusant in the diffusion region.

15. The integrated circuit device of claim 11, wherein the integrated circuit device further comprises a control circuit connected to the monitor device and configured to supply the stimulus, wherein the stimulus comprises at least one of a voltage stimulus or a current stimulus.

16. The integrated circuit device of claim 11, wherein the monitor device is integrated on a same substrate as the core circuit.

17. The integrated circuit device of claim 11, wherein the diffusant comprises one or more elements selected from the group consisting of aluminum (Al), cobalt (Co), platinum (Pt), sulfur (S), nickel (Ni), silver (Ag), zinc (Zn), gold (Au), chromium (Cr), copper (Cu), iron (Fe), sodium (Na) and potassium (K).

18. An integrated circuit device comprising a monitor device comprising a reservoir and a diffusion region into which a diffusant from the reservoir diffuses, wherein the monitor device is configured to distinguishably record indications of a core circuit being exposed to stress conditions at different times by diffusing the diffusant from the reservoir into the diffusion region in response to the stress conditions at different times.

19. The integrated circuit device of claim 18, wherein the monitor device is configured to:

diffuse the diffusant into the diffusion region in a first direction to form a first diffusion profile in the diffusion region in response to a first stress condition;

translate the first diffusion profile in a second direction different from the first direction; and

diffuse the diffusant in the first direction to form a second diffusion profile in the diffusion region in response to a second stress condition subsequent to the first stress condition.

20. The integrated circuit device of claim 19, wherein the first diffusion profile and the second diffusion profile are non-overlapping.

21. The integrated circuit device of claim 19, wherein the monitor device is configured to apply an electric field to the diffusion region in the second direction, and wherein the diffusant has a charge state when diffused in the diffusion region such that, when the electric field is applied to the diffusion region having the diffusant diffused therein, the electric field causes the first diffusion profile to be translated in the second first direction.

22. The integrated circuit device of claim 21, wherein the diffusion region is disposed in a semiconductor substrate and the reservoir containing the diffusant is formed on a surface of the semiconductor substrate such that the stress conditions cause the diffusant to diffuse in the first direction normal to the semiconductor substrate surface, and the electric field causes the first diffusion profile to be translated in the second direction different from the first direction normal to the semiconductor substrate surface.

23. The integrated circuit device of claim 21, further comprising a plurality of conductive structures formed on a surface of the diffusion region along the second direction to provide electrical access to the diffusion region at a plurality of locations.

24. The integrated circuit device of claim 23, wherein the monitor device is configured to apply the electric field by applying a voltage on one or more of the conductive structures.

25. The integrated circuit device of claim 18, wherein the stress conditions include an electrical overstress (EOS) event.

26. The integrated circuit device of claim 18, wherein the monitor device is configured to record the indications of the core circuit being exposed to the stress conditions at different times without being powered, and wherein the integrated circuit device further comprises circuitry configured to read the indications upon being powered.