Photo-curable and heat-curable resin composition and dry film solder resist

• US 10,795,259 B2
• Filed: 02/03/2017
• Issued: 10/06/2020
• Est. Priority Date: 02/05/2016
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: LG Chem Limited (LG Corporation)
• Inventors: Choi, Byung Ju, Kyung, You Jin, Jeong, Woo Jae, Choi, Bo Yun, Jeong, Min Su
• Primary Examiner(s): Hamilton, Cynthia
• Application Number:
  US15/764,544
• Publication Number:
  US 20190056658A1
• Time in Patent Office: 1,341 Days
• CPC Class Codes: C08F 122/14 Esters having no free carboxylic acid groups
• CPC Class Codes: C08F 2/44 Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• CPC Class Codes: C08F 2/50 with sensitising agents
• CPC Class Codes: C08F 222/106 Esters of polycondensation macromers
• CPC Class Codes: C08F 290/08 on to polymers modified by introduction of unsaturated side groups
• CPC Class Codes: C08K 3/34 Silicon-containing compounds
• CPC Class Codes: C08K 7/00 Use of ingredients characterised by shape
• CPC Class Codes: C08L 35/02 Homopolymers or copolymers of esters C08L35/06, C08L35/08 take precedence
• CPC Class Codes: C09D 4/00 Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
• CPC Class Codes: G03F 7/0047 characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/029 Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
• CPC Class Codes: H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
• CPC Class Codes: H05K 3/287 Photosensitive compositions
• CPC Class Codes: H05K 3/3452 Solder masks

Abstract

The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.

Claims

1. A photo-curable and heat-curable resin composition including:

an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in a molecule;

a photopolymerizable monomer having at least two photo-curable unsaturated functional groups;

a heat-curable binder having a heat-curable functional group;

a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa);

a dispersant; and

a photo-initiator,

wherein the plate-like inorganic filler comprises a plate-like talc powder having whiteness of 90% or higher, a particle size (D50) of 0.5 to 2 μ

m, a top size of 3 to 10 μ

m, a water content of 0.3 to 1% measured by JIS-K5101, an apparent density of 0.07 to 0.2 g/ml, and a specific surface area of 17 to 30 m²/g measured by the BET method.

2. The photo-curable and heat-curable resin composition of claim 1, wherein the plate-like inorganic filler comprises a plate-like talc powder having whiteness of 96% or higher, a particle size (D50) of 0.6 to 1.5 μ

m, a top size of 4 to 7 μ

m, a water content of 0.5 to 0.7% measured by JIS-K5101, an apparent density of 0.09 to 0.1 g/ml, and a specific surface area of 18 to 24 m²/g measured by the BET method.

3. The photo-curable and heat-curable resin composition of claim 1, wherein the plate-like inorganic filler is contained in an amount of 20% by weight to 60% by weight of the solid content of the total composition.

4. The photo-curable and heat-curable resin composition of claim 3, wherein the plate-like inorganic filler is contained in an amount of 40% by weight to 55% by weight in the solid content of the total composition.

5. The photo-curable and heat-curable resin composition of claim 1, wherein the dispersant is contained in an amount of 1% by weight to 6% by weight based on the total solid content of the resin composition.

6. The photo-curable and heat-curable resin composition of claim 1, wherein the acid-modified oligomer includes an epoxy (meth)acrylate-based compound.

7. The photo-curable and heat-curable resin composition of claim 1, wherein the acid-modified oligomer is contained in an amount of 5% by weight to 75% by weight based on the total weight of the resin composition.

8. The photo-curable and heat-curable resin composition of claim 1, wherein the photopolymerizable monomer includes an acrylate-based compound having at least two photo-curable unsaturated functional groups.

9. The photo-curable and heat-curable resin composition of claim 1, wherein the photopolymerizable monomer includes at least one compound selected from the group consisting of a hydroxyl group-containing acrylate-based compound, a water-soluble acrylate-based compound, a polyester acrylate-based compound, a polyurethane acrylate-based compound, an epoxy acrylate-based compound and a caprolactone modified-acrylate-based compound.

10. The photo-curable and heat-curable resin composition of claim 1, wherein the photo-initiator is contained in an amount of 0.5% by weight to 20% by weight based on the total weight of the resin composition.

11. The photo-curable and heat-curable resin composition of claim 1, wherein the heat-curable functional group is at least one selected from the group consisting of an epoxy group, an oxetanyl group, a cyclic ether group, and a cyclic thioether group.

12. The photo-curable and heat-curable resin composition of claim 1, wherein the heat-curable binder is contained in an amount corresponding to 0.5 to 2.0 equivalents based on 1 equivalent of a carboxyl group of the acid-modified oligomer.

13. The photo-curable and heat-curable resin composition of claim 1, further including a solvent;

and at least one selected from the group consisting of an epoxy curing agent, a heat-curable binder catalyst, a pigment, and an additive.

14. A dry film solder resist including a cured product of an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule;

a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; and

a heat-curable binder having a heat-curable functional group, and

a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa) which is dispersed in the cured product.

15. The dry film solder resist of claim 14, including:

a cross-linked structure in which a photo-curable functional group of the acid-modified oligomer and a heat-curable functional group of the heat-curable binder are cross-linked;

a cross-linked structure in which a photo-curable functional group of the acid-modified oligomer and an unsaturated functional group of the photopolymerizable monomer are cross-linked to each other; and

a cross-linked structure derived from the acid-modified oligomer.

16. The dry film solder resist of claim 14, wherein the acid-modified oligomer is an epoxy (meth)acrylate-based compound.

17. The dry film solder resist of claim 14, wherein the dry film solder resist has a coefficient of thermal expansion of less than 40 ppm/K.

18. The dry film solder resist of claim 14, wherein the dry film solder resist has a Young'"'"'s modulus of 4 to 12 Gpa.

19. The dry film solder resist of claim 14, wherein the plate-like organic filler comprises a plate-like talc powder having whiteness of 90% or higher, a particle size (D50) of 0.5 to 2 μ

m, a top size of 3 to 10 μ

m, a water content of 0.3 to 1% measured by JIS-K5101, an apparent density of 0.07 to 0.2 g/ml, and a specific surface area of 15 to 30 m²/g measured by the BET method.

20. The dry film solder resist of claim 14, wherein the plate-like organic filler is contained in an amount of 20% by weight to 60% by weight of the solid content of the solder resist.