Manufacturing method for IGZO active layer and oxide thin film transistor
First Claim
1. A manufacturing method for an IGZO active layer, comprising steps of:
- after depositing a first metal layer and a gate insulation layer on a substrate, depositing an IGZO material on the gate insulation layer, and forming an IGZO film; and
performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to adjust element contents on the surface of the IGZO film to form an IGZO active layer;
wherein the plasma cleaning treatment uses a power of 3000˜
4000 watts;
a gas pressure of 30˜
50 mTorr;
a gas flow rate of 500˜
1000 standard milliliter/min, and a processing time of 5˜
20 seconds.
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Accused Products
Abstract
A manufacturing method for an IGZO active layer is disclosed. The method comprises steps of: after depositing a first metal layer and a gate insulation layer on a substrate, depositing an IGZO material on the gate insulation layer, and forming an IGZO film; and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to adjust element contents on the surface of the IGZO film, and forming an IGZO active layer. The present invention also correspondingly discloses a manufacturing method for an oxide thin film transistor. By implementing the embodiments of the present invention, the elements on the film surface of the IGZO active layer can be adjusted to improve electrical properties.
2 Citations
6 Claims
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1. A manufacturing method for an IGZO active layer, comprising steps of:
-
after depositing a first metal layer and a gate insulation layer on a substrate, depositing an IGZO material on the gate insulation layer, and forming an IGZO film; and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to adjust element contents on the surface of the IGZO film to form an IGZO active layer; wherein the plasma cleaning treatment uses a power of 3000˜
4000 watts;
a gas pressure of 30˜
50 mTorr;
a gas flow rate of 500˜
1000 standard milliliter/min, and a processing time of 5˜
20 seconds. - View Dependent Claims (2)
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-
3. A manufacturing method for an oxide thin film transistor, comprising steps of:
-
providing a substrate, and depositing a first metal layer on the substrate to form a gate electrode; depositing a gate insulation layer on the first metal layer; depositing an IGZO material on the gate insulation layer to form an IGZO film, and performing a plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas to form an IGZO active layer; and depositing a second metal layer on the IGZO active layer and etching the second metal layer to form a source electrode and a drain electrode; wherein the step of performing plasma cleaning treatment on a surface of the IGZO film by using an argon gas or a helium gas includes a step of; performing a plasma cleaning treatment to a film surface of the IGZO active layer using the argon gas or the helium gas, wherein a power adopted in the plasma cleaning treatment is 1000˜
6000 watts;
a gas pressure is 30˜
70 mTorr, and the gas flow rate is 200˜
2000 standard milliliter/min;
a processing time is 0˜
120 seconds. - View Dependent Claims (4, 5, 6)
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Specification