Electrostatic cleaning device

• US 10,804,127 B2
• Filed: 03/14/2016
• Issued: 10/13/2020
• Est. Priority Date: 04/01/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Bathurst, Stephen P., Higginson, John A., Golda, Dariusz, Kim, Hyeun-Su
• Primary Examiner(s): Jennings, Michael D
• Application Number:
  US15/562,738
• Publication Number:
  US 20180076076A1
• Time in Patent Office: 1,674 Days
• CPC Class Codes: B08B 6/00 Cleaning by electrostatic means domestic cleaning implements functioning electrostatically A47L13/40; cleaning of grooved record carriers G11B3/58
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/67721 the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames H01L21/6773 takes precedence
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks

Abstract

An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.

Claims

1. An electrostatic cleaning device comprising:

a cleaning electrode area including a first electrode pattern including a plurality of first fingers, and a second electrode pattern including a plurality of second fingers, wherein the plurality of first fingers are laterally parallel to and interdigitated with the plurality of second fingers;

a first trace line connected to the first electrode pattern; and

a dielectric layer covering the cleaning electrode area and the first trace line.

2. The electrostatic cleaning device of claim 1, wherein the first electrode pattern includes a comb configuration and the second electrode pattern includes a comb configuration.

3. The electrostatic cleaning device of claim 1, further comprising:

a second trace line connected to the second electrode pattern; and

wherein the dielectric layer covers the cleaning electrode area, the first trace line and the second trace line.

4. The electrostatic cleaning device of claim 3, wherein the cleaning electrode area, the first trace line, and the second trace line are formed in a silicon layer.

5. The electrostatic cleaning device of claim 4, further comprising a base substrate, and an insulator layer between the silicon layer and the base substrate.

6. The electrostatic cleaning device of claim 3, further comprising a plurality of additional electrically separate cleaning electrode areas and a corresponding plurality of additional electrically separate first trace lines, and the dielectric layer covers each additional cleaning electrode area and each additional first trace line.

7. The electrostatic cleaning device of claim 6, wherein each additional cleaning electrode area includes an additional second electrode pattern interdigitated with an additional first electrode pattern, and further comprising a corresponding plurality of additional electrically separate second trace lines.

8. The electrostatic cleaning device of claim 1, further comprising a flex circuit coupled with the first trace line.

9. An electrostatic cleaning device comprising:

a plurality of electrically separate cleaning electrode areas, each cleaning electrode area including a first electrode pattern and a second electrode pattern interdigitated with the first electrode pattern;

a corresponding plurality of electrically separate first trace lines, each first trace line connected to the first electrode pattern;

a corresponding plurality of electrically separate second trace lines, each second trace line connected to the second electrode pattern;

a dielectric layer covering each cleaning electrode area, each first trace line, and each econ trace line;

a first corresponding plurality of conductive contacts electrically coupled with the plurality of electrically separate first trace lines; and

a second corresponding plurality of conductive contacts electrically coupled with the plurality of electrically separate second trace lines.

10. The electrostatic cleaning device of claim 9, wherein the plurality of conductive contacts are electrically coupled with a plurality of via plugs.

11. The electrostatic cleaning device of claim 9, further comprising a conductive ground contact.

12. The electrostatic cleaning device of claim 11, further comprising a flex circuit coupled with the first corresponding plurality of conductive contacts, the second corresponding plurality of conductive contacts, and the conductive ground contact.

13. A mass transfer tool comprising:

a carrier substrate stage;

a receiving substrate stage;

an electrostatic cleaning stage;

an electrostatic cleaning device that is detachably coupleable with the electrostatic cleaning stage, wherein the electrostatic cleaning device comprises;

a cleaning electrode area including a first electrode pattern including a plurality of first fingers and a second electrode pattern including a plurality of second fingers, wherein the plurality of first fingers are laterally parallel to and interdigitated with the plurality of second fingers;

a first trace line connected to the first electrode pattern; and

a dielectric layer covering the cleaning electrode area and the first trace line; and

a translatable transfer head assembly that is translatable over the carrier substrate stage, the receiving substrate stage, and the electrostatic cleaning stage.

14. The mass transfer tool of claim 13, further comprising a translation track, wherein the translatable transfer head assembly is coupled with the translation track and the translatable transfer head assembly is movable along the translation track over the carrier substrate stage, the receiving substrate stage, and the electrostatic cleaning stage.

15. The mass transfer tool of claim 13, further comprising an upward facing inspection camera.

16. The mass transfer tool of claim 13, wherein the upward facing inspection camera is located between the receiving substrate stage and the carrier substrate stage.

17. The mass transfer tool of claim 13, further comprising a pair of voltage sources to supply separate operating voltages to the electrostatic cleaning device.

18. The mass transfer tool of claim 13, further comprising a micro pick up array including an array of bipolar electrostatic transfer heads that is detachably coupleable with the translatable transfer head assembly.

19. A micro device transfer and cleaning method comprising:

picking up an array of micro devices with a micro pick up array;

placing the array of micro devices on a receiving substrate;

inspecting the micro pick up array to locate a micro device retained on the micro pick up array after placing the array of micro devices on the receiving substrate; and

cleaning the micro pick up array with an electrostatic cleaning device to remove the micro device from the micro pick up array;

wherein the electrostatic cleaning device comprises;

a cleaning electrode area including a first electrode pattern including a plurality of first fingers and a second electrode pattern including a plurality of second fingers, wherein the plurality of first fingers are laterally parallel to and interdigitated with the plurality of second fingers;

a first trace line connected to the first electrode pattern; and

a dielectric layer covering the cleaning electrode area and the first trace line.

20. The method of claim 19, wherein cleaning the micro pick up array with the electrostatic cleaning device comprises:

bringing the micro pick up array into close contact with the electrostatic cleaning device;

applying a voltage to the electrostatic cleaning device to build up charge on the electrostatic cleaning device; and

withdrawing the micro pick up array from the electrostatic cleaning device.

21. The method of claim 19, further comprising removing the voltage from the electrostatic cleaning device to remove the charge from the electrostatic cleaning device, and indexing the electrostatic cleaning device to a clean location.