Antenna waveguide transitions for solid state power amplifiers

• US 10,812,021 B2
• Filed: 07/11/2018
• Issued: 10/20/2020
• Est. Priority Date: 08/22/2017
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Mohan, Ankush, Yoon, Soack, Denninghoff, Dan
• Primary Examiner(s): Pascal, Robert J
• Assistant Examiner(s): Glenn, Kimberly E
• Application Number:
  US16/032,252
• Publication Number:
  US 20190068123A1
• Time in Patent Office: 832 Days
• Field of Search: 330307
• CPC Class Codes: H01P 3/08 Microstrips; Strip lines
• CPC Class Codes: H01P 5/19 of the junction type
• CPC Class Codes: H01Q 13/085 Slot-line radiating ends
• CPC Class Codes: H03F 1/0205 in transistor amplifiers
• CPC Class Codes: H03F 2200/255 Amplifier input adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
• CPC Class Codes: H03F 2200/315 the loading circuit of an amplifying stage comprising a transmission line
• CPC Class Codes: H03F 2200/423 Amplifier output adaptation especially for transmission line coupling purposes, e.g. impedance adaptation
• CPC Class Codes: H03F 3/195 in integrated circuits
• CPC Class Codes: H03F 3/213 in integrated circuits

Abstract

Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed. An SSPA includes a waveguide channel that is configured to propagate an input signal, such as an electromagnetic signal, from an input port to a solid state amplifier for amplification. The waveguide channel is further configured to propagate an amplified signal from the solid state amplifier to an output port. Waveguide transitions to and from the solid state amplifier are bandwidth matched to the waveguide channel. Additionally, the waveguide transitions may be thermally coupled to the waveguide channel. The waveguide transitions may include antenna structures that have a signal conductor and a ground conductor. In this manner, the SSPA may have improved broadband coupling as well as improved thermal dissipation for heat generated by the solid state amplifier.

Claims

1. A solid state power amplifier (S SPA) comprising:

a solid state amplifier;

an input port and an output port;

a waveguide channel configured to propagate an input signal from the input port to the solid state amplifier and configured to propagate an amplified signal from the solid state amplifier to the output port, wherein the waveguide channel forms a hollow waveguide;

an input antenna structure inside the waveguide channel that is configured to transition the input signal from the waveguide channel to the solid state amplifier; and

an output antenna structure inside the waveguide channel that is configured to transition the amplified signal from the solid state amplifier to the waveguide channel.

2. The SSPA of claim 1 wherein the input antenna structure further comprises an input signal conductor and an input ground conductor.

3. The SSPA of claim 2 wherein the input signal conductor and the input ground conductor are on opposing faces of a substrate.

4. The SSPA of claim 3 wherein the input signal conductor and the input ground conductor are separated by air.

5. The SSPA of claim 4 wherein the input antenna structure and the output antenna structure are bandwidth matched to the waveguide channel.

6. The SSPA of claim 1 wherein at least one of the input antenna structure and the output antenna structure are thermally coupled to one or more walls of the waveguide channel.

7. The SSPA of claim 1 wherein the solid state amplifier comprises a monolithic microwave integrated circuit (MMIC) amplifier.

8. The SSPA of claim 7 wherein the MMIC amplifier comprises a gallium nitride (GaN)-based MMIC.

9. A solid state power amplifier (SSPA) comprising:

a plurality of solid state amplifiers;

an input port and an output port;

a waveguide channel connected to the input port and the output port, wherein the waveguide channel comprises;

a first plurality of waveguide segments that individually connect with separate solid state amplifiers of the plurality of solid state amplifiers; and

a second plurality of waveguide segments that individually connect with separate solid state amplifiers of the plurality of solid state amplifiers and combine the waveguide channel;

a plurality of input antenna structures inside the first plurality of waveguide segments that are configured to transition portions of a signal propagating through the first plurality of waveguide segments to the plurality of solid state amplifiers; and

a plurality of output antenna structures inside the second plurality of waveguide segments that are configured to transition portions of an amplified signal from the plurality of solid state amplifiers to the waveguide channel.

10. The SSPA of claim 9 wherein the plurality of solid state amplifiers comprises at least four solid state amplifiers.

11. The SSPA of claim 9 wherein each input antenna structure of the plurality of input antenna structures comprises an input signal conductor and an input ground conductor.

12. The SSPA of claim 11 wherein the input signal conductor and the input ground conductor are on opposing faces of a substrate.

13. The SSPA of claim 11 wherein the input signal conductor and the input ground conductor are separated by air.

14. The SSPA of claim 9 wherein each output antenna structure of the plurality of output antenna structures comprises an output signal conductor and an output ground conductor.

15. The SSPA of claim 14 wherein the output signal conductor and the output ground conductor are on opposing faces of a substrate.

16. The SSPA of claim 14 wherein the output signal conductor and the output ground conductor are separated by air.

17. The SSPA of claim 9 wherein at least one input antenna structure of the plurality of input antenna structures and at least one output antenna structure of the plurality of output antenna structures are thermally coupled to a wall of the waveguide channel.

18. The SSPA of claim 9 further comprising a housing that includes a plurality of housing segments that form the waveguide channel.

19. The SSPA of claim 18 wherein the plurality of housing segments comprises a plurality of hollow channels that form the waveguide channel.

20. The SSPA of claim 9 wherein the plurality of solid state amplifiers comprises a plurality of monolithic microwave integrated circuit (MMIC) amplifiers.