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Method of manufacturing a computer device

  • US 10,820,409 B1
  • Filed: 02/28/2020
  • Issued: 10/27/2020
  • Est. Priority Date: 12/20/2019
  • Status: Active Grant
First Claim
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1. A computer structure comprising:

  • a first silicon substrate in which is formed computer circuitry configured to perform computing operations, the first substrate having a self-supporting depth and an inner facing surface;

    a second silicon substrate in which is formed a plurality of distributed capacitance units, the second substrate having an inner facing surface located in overlap with the inner facing surface of the first substrate and connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces, the inner facing surface of the second silicon substrate having planar surface dimensions matching the planar surface dimensions of the inner facing surface of the first silicon substrate;

    the second substrate having an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage, wherein the second substrate has a smaller depth than the first substrate.

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