Method of manufacturing a computer device
First Claim
1. A computer structure comprising:
- a first silicon substrate in which is formed computer circuitry configured to perform computing operations, the first substrate having a self-supporting depth and an inner facing surface;
a second silicon substrate in which is formed a plurality of distributed capacitance units, the second substrate having an inner facing surface located in overlap with the inner facing surface of the first substrate and connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces, the inner facing surface of the second silicon substrate having planar surface dimensions matching the planar surface dimensions of the inner facing surface of the first silicon substrate;
the second substrate having an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage, wherein the second substrate has a smaller depth than the first substrate.
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Abstract
According to a first aspect, there is provided a computer structure comprising a first silicon substrate and a second silicon substrate. Computer circuitry configured to perform computing operations is formed in the first silicon substrate, which has a self-supporting depth and an inner facing surface. A plurality of distributed capacitance units are formed in the second silicon substrate, which has an inner facing surface located in overlap with the inner facing surface of the first substrate and is connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces. The inner facing surfaces have matching planar surface dimensions. The second substrate has an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage. The second substrate has a smaller depth than the first substrate.
11 Citations
25 Claims
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1. A computer structure comprising:
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a first silicon substrate in which is formed computer circuitry configured to perform computing operations, the first substrate having a self-supporting depth and an inner facing surface; a second silicon substrate in which is formed a plurality of distributed capacitance units, the second substrate having an inner facing surface located in overlap with the inner facing surface of the first substrate and connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces, the inner facing surface of the second silicon substrate having planar surface dimensions matching the planar surface dimensions of the inner facing surface of the first silicon substrate; the second substrate having an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage, wherein the second substrate has a smaller depth than the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A semiconductor die comprising:
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a first semiconductor substrate in which is formed computer circuitry configured to perform computing operations, the first semiconductor substrate having a self-supporting depth and an inner facing surface; a second semiconductor substrate in which is formed a plurality of distributed capacitance units, the second semiconductor substrate having an inner facing surface located in overlap with the inner facing surface of the first semiconductor substrate and connected to the first semiconductor substrate via a set of connectors arranged extending depthwise of the semiconductor die between the inner facing surfaces; the second semiconductor substrate having an outer facing surface on which are arranged a plurality of connector terminals for connecting the semiconductor die to a supply voltage, wherein the second semiconductor substrate has a smaller depth than the first semiconductor substrate. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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Specification