Heat conduction component and mobile terminal

• US 10,831,249 B2
• Filed: 07/31/2017
• Issued: 11/10/2020
• Est. Priority Date: 03/02/2017
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Jiang, Huawen, Jin, Linfang
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US16/490,822
• Publication Number:
  US 20190391623A1
• Time in Patent Office: 1,198 Days
• Field of Search: 36167952
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.

Claims

1. A middle plate, comprising:

a heat conduction component comprising;

a support part defining a cavity;

a heat dissipation part disposed in the cavity and having mesh capillary holes and a heat dissipating channel that comprises a through hole that extends from a first end of the heat dissipation part to a second end of the heat dissipation part, wherein the mesh capillary holes are located outside of the heat dissipating channel, wherein the first end of the heat dissipation part is configured to fit a heat source component, wherein a low temperature area is located at the second end of the heat dissipation part, and wherein a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is configured to fit; and

a heat conduction medium disposed in the mesh capillary holes and configured to conduct heat generated by the heat source component from the first end to the second end when the heat source component operates.

2. The middle plate of claim 1, wherein the support part consists of a single metal part that fully encloses the cavity, wherein the through hole is cylindrical, wherein the heat dissipation channel is configured to provide a channel for a gaseous heat conduction medium, wherein the mesh capillary holes are configured to provide channels for a liquid heat conduction medium, and wherein a function of the heat dissipation part is as follows when the heat source component operates:

the liquid heat conduction medium in the mesh capillary holes is changed from a liquid state to a gaseous state at the first end of the heat dissipation part under the action of heat generated by the heat source component, the gaseous heat conduction medium flows to the second end of the heat dissipation part through the heat dissipation channel and is changed from the gaseous state to the liquid state at the second end of the heat dissipation part under the action of a low temperature of the low temperature area, and the liquid heat conduction medium is returned through the mesh capillary holes to the first end.

3. The middle plate of claim 2, further comprising a second heat dissipation channel in the cavity.

4. The middle plate of claim 3, wherein a plurality of heat dissipation channels are mutually disposed in parallel.

5. The middle plate of claim 2, wherein a shape of the cavity in which the heat dissipation part is disposed is determined with reference to positions of the heat source component and the low temperature area.

6. The middle plate of claim 2, wherein a size of the cavity in which the heat dissipation part is disposed is determined with reference to positions of the heat source component and the low temperature area.

7. The middle plate of claim 1, wherein the heat conduction component further comprises a rib disposed in the heat dissipation part and connected to the support part.

8. The middle plate of claim 7, wherein a length direction of the rib is perpendicular to a length direction of the support part.

9. The middle plate of claim 8, wherein the rib and the support part have a same three dimensional (3D) sintering process parameter.

10. The middle plate of claim 1, wherein the support part and the heat dissipation part have different three dimensional (3D) sintering process parameters.

11. A mobile terminal, comprising:

a front housing;

a rear housing; and

a middle plate coupled to and between the front housing and the rear housing and comprising;

a heat conduction component comprising;

a support part comprising a cavity;

a heat dissipation part disposed in the cavity and having mesh capillary holes and a heat dissipating channel that comprises a through hole that extends from a first end of the heat dissipation part to a second end of the heat dissipation part, wherein the mesh capillary holes are located outside of the heat dissipating channel, wherein the first end of the heat dissipation part is configured to fit a heat source component, wherein a low temperature area is located at the second end of the heat dissipation part, and wherein a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is configured to fit; and

a heat conduction medium disposed in the mesh capillary holes and configured to conduct heat generated by the heat source component from the first end to the second end when the heat source component operates.

12. The mobile terminal of claim 11, wherein the support part consists of a single metal part that fully encloses the cavity, wherein the through hole is cylindrical, wherein the heat dissipation channel is configured to provide a channel for a gaseous heat conduction medium, wherein the mesh capillary holes are configured to provide channels for a liquid heat conduction medium, and wherein a function of the heat dissipation part is as follows when the heat source component operates:

the liquid heat conduction medium in the mesh capillary is holes is changed from a liquid state to a gaseous state at the first end of the heat dissipation part under the action of heat generated by the heat source component, the gaseous heat conduction medium flows to the second end of the heat dissipation part through the heat dissipation channel and is changed from the gaseous state to the liquid state at the second end of the heat dissipation part under the action of a low temperature of the low temperature area, and the liquid heat conduction medium is returned through the mesh capillary holes to the first end.

13. The mobile terminal of claim 12, further comprising a second heat dissipation channel within the cavity.

14. The mobile terminal of claim 12, wherein a plurality of heat dissipation channels are mutually disposed in parallel.

15. The mobile terminal of claim 11, wherein a size of the cavity in which the heat dissipation part is disposed is determined with reference to positions of the heat source component and the low temperature area.

16. The mobile terminal of claim 11, wherein a shape of the cavity in which the heat dissipation part is disposed is determined with reference to positions of the heat source component and the low temperature area.

17. The mobile terminal of claim 11, wherein the heat conduction component further comprises a rib disposed in the heat dissipation part and connected to the support part.

18. The mobile terminal of claim 17, wherein a length direction of the rib is perpendicular to a length direction of the support part.

19. The mobile terminal of claim 17, wherein the rib and the support part have a same three dimensional (3D) sintering process parameter.

20. The mobile terminal of claim 11, wherein the support part and the heat dissipation part have different three dimensional (3D) sintering process parameters.