Method of producing an electronic device
First Claim
Patent Images
1. A method of producing an electronic device, comprising the steps of:
- operating a jetting device to deposit drops of an adhesive material in a first pattern on a surface of a first substrate;
vaporizing water in the adhesive and heating the first substrate to a temperature between 25°
C. and 200°
C.;
bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
activating the adhesive material while the portion of the metal foil is in contact with the adhesive material; and
separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate.
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Accused Products
Abstract
A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.
75 Citations
9 Claims
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1. A method of producing an electronic device, comprising the steps of:
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operating a jetting device to deposit drops of an adhesive material in a first pattern on a surface of a first substrate; vaporizing water in the adhesive and heating the first substrate to a temperature between 25°
C. and 200°
C.;bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material; activating the adhesive material while the portion of the metal foil is in contact with the adhesive material; and separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification