Mini light emitting diode backlight module and manufacturing method of fluorescent film layer

• US 10,859,240 B2
• Filed: 04/24/2018
• Issued: 12/08/2020
• Est. Priority Date: 03/28/2018
• Status: Active Grant

• Current Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Cheng, Yan
• Primary Examiner(s): Chakraborty, Rajarshi
• Assistant Examiner(s): Chiang, Michael
• Application Number:
  US16/069,303
• Publication Number:
  US 20200355348A1
• Time in Patent Office: 959 Days
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 17/10 characterised by specific fastening means or way of fastening F21V17/02 - F21V17/08 take precedence
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 9/32 characterised by the arrangement of the photoluminescent material
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133607 the light controlling member including light directing or refracting elements, e.g. prisms or lenses
• CPC Class Codes: G02F 1/133614 using photoluminescence, e.g. phosphors illuminated by UV or blue light

Abstract

Disclosed is a mini light emitting diode backlight module, comprising a light emitting diode light source and a fluorescent film layer, wherein the light emitting diode light source comprises a substrate and mini light emitting diode lamp beads arranged in an array on the substrate, and the fluorescent film layer is disposed in a light emitting direction of the light emitting diode light source, and a surface of the fluorescent film layer toward the mini light emitting diode lamp beads is provided with grooves arranged in an array. By designing the fluorescent film layer having a specific shape, and placing the same in front of the mini light emitting diode lamp beads, the light leakage can be avoided and the light path can be changed to solve the problem of hotspot and light leakage around in the mini light emitting diode backlight module.

Claims

1. A mini light emitting diode backlight module, comprising a light emitting diode light source and a fluorescent film layer, wherein the light emitting diode light source comprises a substrate and mini light emitting diode lamp beads arranged in an array on the substrate, and the fluorescent film layer is disposed in a light emitting direction of the light emitting diode light source, and a surface of the fluorescent film layer toward the mini light emitting diode lamp beads is provided with grooves arranged in an array;

wherein a bottom surface of the groove is a concave arc surface, and the fluorescent film layer further comprises convex pillars arranged along edges of the fluorescent film layer in a circle at intervals, and the convex pillars and the grooves are respectively disposed on two opposite surfaces of the fluorescent film layer.

2. The mini light emitting diode backlight module according to claim 1, further comprising a diffusion film, wherein edges of a bottom surface of the diffusion film are attached to surfaces of the convex pillars.

3. The mini light emitting diode backlight module according to claim 2, further comprising a light shielding adhesive, wherein the light shielding adhesive is adhered on edges of a top surface of the diffusion film, and is extended to be adhered to lateral sides of the convex pillars and a bottom surface of the substrate.

4. The mini light emitting diode backlight module according to claim 1, wherein a number of the grooves is not less than a number of the mini light emitting diode lamp beads, and each of the mini light emitting diode lamp beads is directly opposite to at least one of the grooves.

5. The mini light emitting diode backlight module according to claim 4, wherein a bottom surface of the groove is a concave arc surface.

6. The mini light emitting diode backlight module according to claim 5, wherein the fluorescent film layer further comprises convex pillars arranged along edges of the fluorescent film layer in a circle at intervals, and the convex pillars and the grooves are respectively disposed on two opposite surfaces of the fluorescent film layer.

7. The mini light emitting diode backlight module according to claim 6, further comprising a diffusion film, wherein edges of a bottom surface of the diffusion film are attached to surfaces of the convex pillars.

8. The mini light emitting diode backlight module according to claim 7, further comprising a light shielding adhesive, wherein the light shielding adhesive is adhered on edges of a top surface of the diffusion film, and is extended to be adhered to lateral sides of the convex pillars and a bottom surface of the substrate.

9. The mini light emitting diode backlight module according to claim 4, wherein a radial dimension of the groove is not less than a radial dimension of the mini light emitting diode lamp bead, which is directly opposite thereto, and each of the mini light emitting diode bead faces one of the grooves.

10. The mini light emitting diode backlight module according to claim 9, wherein a bottom surface of the groove is a concave arc surface.

11. The mini light emitting diode backlight module according to claim 10, wherein the fluorescent film layer further comprises convex pillars arranged along edges of the fluorescent film layer in a circle at intervals, and the convex pillars and the grooves are respectively disposed on two opposite surfaces of the fluorescent film layer.

12. The mini light emitting diode backlight module according to claim 11, further comprising a diffusion film, wherein edges of a bottom surface of the diffusion film are attached to surfaces of the convex pillars.

13. The mini light emitting diode backlight module according to claim 12, further comprising a light shielding adhesive, wherein the light shielding adhesive is adhered on edges of a top surface of the diffusion film, and is extended to be adhered to lateral sides of the convex pillars and a bottom surface of the substrate.

14. The mini light emitting diode backlight module according to claim 9, further comprising a diffusion film and a light shielding adhesive, wherein a bottom surface of the groove is a concave arc surface, and the fluorescent film layer further comprises convex pillars arranged along edges of the fluorescent film layer in a circle at intervals, and the convex pillars and the grooves are respectively disposed on two opposite surfaces of the fluorescent film layer, and edges of a bottom surface of the diffusion film are attached to surfaces of the convex pillars, and the light shielding adhesive is adhered on edges of a top surface of the diffusion film, and is extended to be adhered to lateral sides of the convex pillars and a bottom surface of the substrate.

15. A manufacturing method of a fluorescent film layer, comprising:

coating a fluorescent material in a mold, wherein the mold comprises a cavity surrounded by a bottom wall and a sidewall, and the bottom wall is provided with a plurality of protrusions arranged in an array;

placing the fluorescent material with the mold into a curing cavity to age and shape the fluorescent material;

peeling the shaped fluorescent material from the mold to obtain the fluorescent film layer with a surface having grooves arranged in an array;

wherein the mold further comprises cylinder portions in a circle disposed at an outer edge of the bottom wall, and the fluorescent material is also filled in the cylinder portions as coating the fluorescent material in the mold.

16. The manufacturing method of the fluorescent film layer according to claim 15, wherein a temperature in the curing cavity is 60 degrees Celsius to 90 degrees Celsius.