Method and device for transferring a decorating segment of an embossing film

• US 10,870,311 B2
• Filed: 05/31/2016
• Issued: 12/22/2020
• Est. Priority Date: 06/23/2015
• Status: Active Grant

• Current Assignee: Hinderer + Muhlich GmbH & Company KG, Hinder + Muhlich GmbH & Co. KG, Leonhard KURZ Stiftung & Company KG
• Original Assignee: Hinderer + Muhlich GmbH & Company KG
• Inventors: Ammon, Gerhard, Mannsfeld, Tibor, Burkhardt, Markus, Lochner, Thomas
• Primary Examiner(s): Dodds, Scott W
• Application Number:
  US15/735,831
• Publication Number:
  US 20200031160A1
• Time in Patent Office: 1,666 Days
• CPC Class Codes: B41F 19/068 motor-driven
• CPC Class Codes: B44B 5/028 Heated dies
• CPC Class Codes: B44C 1/1729 Hot stamping techniques

Abstract

A method for transferring a decorative section of a stamping foil onto a substrate by means of an embossing die, wherein the stamping foil includes a carrier film and a transfer ply arranged on the carrier film. The method includes:

• a) Provision of the stamping foil;
• b) Embossing or pressing of at least one compression section spaced apart from the edge of the decorative section, into the transfer ply;
• c) Stamping of the decorative section onto the substrate;
• d) Detachment of the residual stamping film from the substrate embossed with the decorative section.

Claims

1. A method for transferring a decorative section of a stamping foil onto a substrate by means of an embossing die, wherein the stamping foil comprises a carrier film and a transfer ply arranged on the carrier film, the method comprising:

a) Provision of the stamping foil;

b) Forming a predetermined mechanically loaded breaking point at a defined position in the transfer ply of the stamping foil by embossing or pressing of at least one compression section, spaced apart from an edge of the decorative section, into the transfer ply, the predefined mechanically loaded breaking point facilitating breaking of the transfer ply when subjected to bending stress;

c) Stamping of the decorative section from the stamping foil onto the substrate, wherein the decorative section is embossed and transferred to the substrate such that remaining portions of the stamping foil not transferred form a residual stamping film;

d) Detachment of the residual stamping film from the substrate embossed with the decorative section by exerting a bending stress at the predefined mechanically loaded breaking point,

wherein, during said embossing or pressing, a pressing pressure p_k is applied, which is greater than a stamping pressure p_p applied during said stamping.

2. The method according to claim 1, wherein the ratio of the pressing pressure p_k to the stamping pressure p_p lies in a range of over 1:

1 to 10,000;

1.

3. The method according to claim 1, wherein the pressing pressure p_k is applied in a linear section or at least piecewise linear section, wherein the linear or at least piecewise linear section is straight, jagged or wavy or has a closed contour, in the form of a circle, ellipse, triangle, rectangle or star.

4. The method according to claim 3, wherein the width of the linear section lies in a range of from 0.02 mm to 0.2 mm.

5. The method according to claim 1, wherein the spacing of the at least one compression section from the edge of the decorative section lies in a range of from 0 mm to 2 mm.