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Minimize image sensor I/O and conductor counts in endoscope applications

  • US 10,881,272 B2
  • Filed: 05/21/2019
  • Issued: 01/05/2021
  • Est. Priority Date: 03/15/2013
  • Status: Active Grant
First Claim
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1. An endoscopic device comprising:

  • an image sensor, having an area sufficient to be located near a tip of a distal end of the endoscopic device, the image sensor comprising;

    a plurality of on-chip registers for configuring operation of the image sensor;

    a plurality of bi-directional pads connected to the image sensor which all operate as pads to input and output digital data from the image sensor such that the number of pads necessary to exchange the input and output of digital data in the image sensor is reduced by combining digital input and output functionality into the same bidirectional pads; and

    a state identifier that identifies what state each bi-directional pad of the plurality of bi-directional pads are in during an operation cycle of the device;

    wherein the image sensor is configured to control each of the plurality of bi-directional pads to have an output state and an input state for sending and receiving data;

    wherein electronic communication between a control circuit and the image sensor is performed through each of the bidirectional pads in a plurality of phases comprising;

    a first service-line phase during which the bi-directional pads are in an output state and non-image data is output from the image sensor,a rolling-readout phase following the first service-line phase and during which the bi-directional pads are in an output state and image data is output from the image sensor,a second service-line phase, following the rolling-readout phase and during which the bi-directional pads are in an output state and non-image data is output from the image sensor, anda configuration phase during which the bi-directional pads are in an input state and instruction data is received by the image sensor through the bi-directional pads.

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