Contact etching and metallization for improved LED device performance and reliability
First Claim
1. A method of manufacturing a light emitting device, the method comprising:
- providing a semiconductor structure comprising an active layer between a first semiconductor layer and a second semiconductor layer, the first semiconductor layer comprising a first surface facing the active layer, and the second semiconductor layer comprising a second surface opposite the active layer;
etching through the second semiconductor layer and through the active layer, to the first surface, to create a via comprising walls;
forming a dielectric structure with at least one angled surface within the via with the at least one angled surface extending from at least one of the walls to the first surface;
forming a dielectric layer over at least a portion of the second surface of the second semiconductor layer and the at least one angled surface; and
forming a metal layer over the dielectric layer and in an opening in the dielectric layer within the via such that the metal layer contacts the first surface of the first semiconductor layer.
4 Assignments
0 Petitions
Accused Products
Abstract
A light emitting device includes a vertical via through the P-type semiconductor layer and the active layer. Using a vertical via reduces quantum well damage, allows shortening of P-N spacing, and allows increased reflective area. A dielectric structure is formed in the via to provide a sloped wall that extends to an upper surface of the device. Another dielectric layer covers the upper surface and the sloped wall, and provides select contacts to the semiconductor layers. A metal layer is subsequently applied. Because the dielectric layers provide a continuous slope from the surface of the device, the metal layer does not include a vertical drop. Because the active layer does not extend into the via, the contact to the N-type semiconductor layer may be situated closer to the wall of the via, increasing the area available for a reflective layer.
11 Citations
20 Claims
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1. A method of manufacturing a light emitting device, the method comprising:
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providing a semiconductor structure comprising an active layer between a first semiconductor layer and a second semiconductor layer, the first semiconductor layer comprising a first surface facing the active layer, and the second semiconductor layer comprising a second surface opposite the active layer; etching through the second semiconductor layer and through the active layer, to the first surface, to create a via comprising walls; forming a dielectric structure with at least one angled surface within the via with the at least one angled surface extending from at least one of the walls to the first surface; forming a dielectric layer over at least a portion of the second surface of the second semiconductor layer and the at least one angled surface; and forming a metal layer over the dielectric layer and in an opening in the dielectric layer within the via such that the metal layer contacts the first surface of the first semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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forming a semiconductor structure comprising an active layer between a first semiconductor layer and a second semiconductor layer, the first semiconductor layer comprising a first surface facing the active layer; forming a via through the second semiconductor layer and the active layer and extending to the first semiconductor layer; forming a first triangular structure in the via, the first triangular structure comprising two sides at a right angle to each other and a third side having a sloped surface between a first side of the via and the first semiconductor layer; forming a second triangular structure in the via spaced apart from the first triangular structure along the first surface of the semiconductor layer, the second triangular structure comprising two sides at a right angle to each other and a third side having a sloped surface between a second side of the via and the first semiconductor layer; and depositing a metal layer over the first triangular structure and the second triangular structure and in contact with the first semiconductor layer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method of fabricating a light emitting device comprising:
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providing a semiconductor structure comprising an active layer between a first semiconductor layer and a second semiconductor layer, the second semiconductor layer comprising a first surface opposite the active layer; etching through the second semiconductor layer, the active layer and at least a portion of the first semiconductor layer to create a via comprising walls formed by the semiconductor structure and a base formed by a remaining portion of the first semiconductor layer; forming a dielectric structure with at least one angled surface within the via with the at least one angled surface extending from at least one of the walls to the base; forming a dielectric layer over at least a portion of the first surface of the second semiconductor layer and the at least one angled surface; and forming a metal layer over the dielectric layer and in an opening in the dielectric layer within the via such that the metal layer contacts the base. - View Dependent Claims (17, 18, 19, 20)
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Specification