Dual zone common catch heat exchanger/chiller
First Claim
1. A method of controlling a temperature of a chuck in a plasma processing apparatus, the method comprising:
- circulating a first heat transfer fluid at a first temperature through the chuck via a first supply line and a first return line coupling the chuck to a first primary heat transfer fluid reservoir;
circulating a second heat transfer fluid at a second temperature through the chuck via a second supply line and a second return line coupling the chuck to a second primary heat transfer fluid reservoir;
controlling a first valve disposed in-line with the first supply line and controlling a second valve disposed in-line with the second supply line; and
maintaining a level of the first primary heat transfer fluid reservoir by catching overflow by gravity from the first primary heat transfer fluid reservoir in a secondary reservoir, the overflow from gravity from above and directly over the secondary reservoir, and dispensing heat transfer fluid from the secondary reservoir to the first primary heat transfer fluid reservoir by a first replenish conduit separate from the first supply line and first return line in response to sensing a low level in the first primary heat transfer fluid reservoir.
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Abstract
Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a coupling each of the reservoirs to a common secondary reservoir. Heat transfer fluid is pumped from the secondary reservoir to either the hot or cold reservoir in response to a low level sensed in the reservoir. In an embodiment, both the hot and cold reservoirs are contained in a same platform as the secondary reservoir with the hot and cold reservoirs disposed above the secondary reservoir to permit the secondary reservoir to catch gravity driven overflow from either the hot or cold reservoir.
72 Citations
11 Claims
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1. A method of controlling a temperature of a chuck in a plasma processing apparatus, the method comprising:
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circulating a first heat transfer fluid at a first temperature through the chuck via a first supply line and a first return line coupling the chuck to a first primary heat transfer fluid reservoir; circulating a second heat transfer fluid at a second temperature through the chuck via a second supply line and a second return line coupling the chuck to a second primary heat transfer fluid reservoir; controlling a first valve disposed in-line with the first supply line and controlling a second valve disposed in-line with the second supply line; and maintaining a level of the first primary heat transfer fluid reservoir by catching overflow by gravity from the first primary heat transfer fluid reservoir in a secondary reservoir, the overflow from gravity from above and directly over the secondary reservoir, and dispensing heat transfer fluid from the secondary reservoir to the first primary heat transfer fluid reservoir by a first replenish conduit separate from the first supply line and first return line in response to sensing a low level in the first primary heat transfer fluid reservoir. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification