Display panel, display device, and method for manufacturing display panel

• US 10,993,330 B2
• Filed: 01/08/2018
• Issued: 04/27/2021
• Est. Priority Date: 05/27/2017
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd., Chengdu BOE Optoelectronics Technology Company Limited (BOE Technology Group Co., Ltd.)
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Dong, Xiangdan, Ko, Youngyik, Hu, Ming, Liu, Tingliang
• Primary Examiner(s): Kusumakar, Karen
• Application Number:
  US16/078,472
• Publication Number:
  US 20200236792A1
• Time in Patent Office: 1,205 Days
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

The present disclosure relates to a display panel and a method of fabricating the same, and a display device. A display panel is provided which comprises: a display substrate having a first face and a second face opposite to the first face, the display substrate including a display area and a non-display area in the first face; a Chip-On-Film (COF) component disposed on the second face, the Chip-On-Film component comprising a COF film and an integrated circuit (IC) chip on the COF film; a connection hole located in the non-display area and at least penetrating the display substrate and the COF film; and an electrical connector disposed in the connection hole and electrically connecting the display substrate and the Chip-On-Film component.

Claims

1. A display panel comprising:

a display substrate having a first surface and a second surface opposite to the first surface, the display substrate including a display area and a non-display area in the first surface and a first terminal on the first surface in the non-display area;

a Chip-On-Film (COF) component disposed on the second surface, the Chip-On-Film component comprising a COF film and an integrated circuit (IC) chip on a surface of the COF film, which faces away from the display substrate, and a second terminal on the surface of the COF film;

a connection hole;

located in the non-display area and at least penetrating the display substrate and the COF film; and

an electrical connector disposed in the connection hole and electrically coupled to the first terminal on the first surface of the display substrate and the second terminal on the surface, which faces away from the display substrate, of the COF film.

2. The display panel according to claim 1 further comprising:

a bonding layer disposed between the COF film and the second surface of the display substrate.

3. The display panel according to claim 2, wherein:

the connection hole and the electrical connector penetrate through the display substrate, the bonding layer and the COF film.

4. The display panel according to claim 1, wherein the connection hole has an aperture greater than or equal to 25 μ

m.

5. The display panel according to claim 1, wherein display substrate is an electroluminescent display substrate or a quantum dot display substrate.

6. The display panel according to claim 1, wherein the COF film is configured to at least partially overlap the non-display area of the display substrate.

7. The display panel according to claim 1, wherein the display substrate is a flexible display substrate.

8. The display panel according to claim 1, further comprising:

a flexible circuit board attached to a side of the COF film, which faces the display substrate, and electrically connected to the COF film.

9. The display panel according to claim 2, wherein the bonding layer is an anisotropic conductive paste.

10. A display device comprising the display panel according to claim 1.

11. A method of manufacturing a display panel, comprising:

providing a display substrate having a first surface and a second surface opposite to the first surface, the display substrate including a display area and a non-display area in the first surface and a first terminal on the first surface in the non-display area;

providing a Chip-On-Film (COF) component on the display substrate, wherein the Chip-On-Film component comprises a COF film and an integrated circuit (IC) chip on a surface of the COF film, which faces away from the display substrate, and a second terminal on the surface of the COF film;

attaching the COF film to the second side of the display substrate through a bonding layer;

forming a connection hole in the non-display area, the connection hole penetrating through the display substrate, the COF film, and the bonding layer; and

forming an electrical connector in the connection hole,

wherein the electrical connector is electrically coupled to the first terminal on the first surface of the display substrate and the second terminal on the surface, which faces away from the display substrate, of the COF film.

12. The method according to claim 11, wherein the bonding layer is anisotropic conductive paste.

13. The method according to claim 11, further comprising:

providing a flexible circuit board attached to a side of the COF film, which faces the display substrate, and electrically connected to the COF film.

14. The method according to claim 11, wherein:

the connection hole is formed by a laser drilling process.

15. The method according to claim 11, wherein the display substrate is a flexible display substrate.