Cloth electronization product and method
First Claim
1. A method for fabricating electronic cloth comprising:
- providing a first cloth layer, at least one hot melt adhesive film and a second cloth layer;
forming circuit wiring on the at least one hot melt adhesive film to provide a film-based circuit board with the at least one hot melt adhesive film as a substrate;
providing at least one electronic component comprising a conductive region and connecting the conductive region to at least one transmission line on the at least one hot melt adhesive film, where a first face of the at least one electronic component is attached to the at least one hot melt adhesive film, wherein a second face of the at least one electronic component, which is opposite to the first face, is attached to the second cloth layer such that the at least one electronic component is fixed between the first cloth layer and the second cloth layer and unmovable with respect to the first cloth layer and the second cloth layer; and
heating the at least one hot melt adhesive film so that the at least one hot melt adhesive film is attached to the first cloth layer and the second cloth layer to package, isolate and secure the at least one electronic component, wherein the at least one hot melt adhesive film is sandwiched by the first cloth layer and the second cloth layer and there is no gap formed therein;
wherein the first cloth layer and the second cloth layer are bonded to the conductive region of the at least one electronic component by the at least one hot melt adhesive film; and
wherein a connection between the conductive region of the at least one electronic component and the at least one transmission line is completely isolated by and completely in contact with the at least one hot melt adhesive film.
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Accused Products
Abstract
Cloth electronic product, by which physiological information can be examined through cloth, includes a packaging cloth or a heat melt adhesive film as circuit, at least an electronic component, such as resistors, microprocessors and sensing assembly, etc., at least a transmission line to be connected with the conductive region of electronic component. Method of producing a cloth electronic product includes sewing the electronic component on packaging cloth or heat melt adhesive film after being connected with the transmission line, or connecting electronic component with the transmission line during the process of jointing of transmission or sewing of packaging cloth or heat melt adhesive film, and then sewing the packaging cloth on the clothing cloth or integrating the heat melt adhesive film into the packaging cloth or clothing cloth. Original structure of the heat melt adhesive film cannot be viewed and miniaturization effects can be produced.
36 Citations
30 Claims
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1. A method for fabricating electronic cloth comprising:
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providing a first cloth layer, at least one hot melt adhesive film and a second cloth layer; forming circuit wiring on the at least one hot melt adhesive film to provide a film-based circuit board with the at least one hot melt adhesive film as a substrate; providing at least one electronic component comprising a conductive region and connecting the conductive region to at least one transmission line on the at least one hot melt adhesive film, where a first face of the at least one electronic component is attached to the at least one hot melt adhesive film, wherein a second face of the at least one electronic component, which is opposite to the first face, is attached to the second cloth layer such that the at least one electronic component is fixed between the first cloth layer and the second cloth layer and unmovable with respect to the first cloth layer and the second cloth layer; and heating the at least one hot melt adhesive film so that the at least one hot melt adhesive film is attached to the first cloth layer and the second cloth layer to package, isolate and secure the at least one electronic component, wherein the at least one hot melt adhesive film is sandwiched by the first cloth layer and the second cloth layer and there is no gap formed therein; wherein the first cloth layer and the second cloth layer are bonded to the conductive region of the at least one electronic component by the at least one hot melt adhesive film; and wherein a connection between the conductive region of the at least one electronic component and the at least one transmission line is completely isolated by and completely in contact with the at least one hot melt adhesive film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for fabricating electronic cloth comprising:
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providing a first cloth layer, a second cloth layer and at least one electronic component comprising a conductive region coupled to a transmission line on a hot melt adhesive film to form a circuit board, at least part of the transmission line being buried in the hot melt adhesive film; wherein; a first face of the at least one electronic component is attached to the hot melt adhesive film; a second face of the at least one electronic component, which is opposite to the first face, is attached to the second cloth layer such that the at least one electronic component is fixed between the first cloth layer and the second cloth layer and unmovable with respect to the first cloth layer and the second cloth layer; the transmission line and the at least one electronic component are directly sewn, by a computerized sewing machine according to a pre-arranged routing plan, on the hot melt adhesive film; a thermal combination machine is used to package the circuit board by heating and feeding the circuit board formed by the hot melt adhesive film and by sandwiching the circuit board with an oil separation paper or fabrics, and there is no gap formed in the hot melt adhesive film. - View Dependent Claims (26, 27, 28, 29, 30)
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Specification