Solid state lamp using light emitting strips

• US 11,009,191 B1
• Filed: 12/04/2020
• Issued: 05/18/2021
• Est. Priority Date: 02/22/2011
• Status: Active Grant

• Current Assignee: Quarkstar LLC
• Original Assignee: Quarkstar LLC
• Inventors: Steele, Robert V., Lerman, Louis, York, Allan Brent, Dau, Wilson, Teng, Jacqueline, Lerman, George
• Primary Examiner(s): Breval, Elmito
• Application Number:
  US17/112,937
• Publication Number:
  US 20210148517A1
• Time in Patent Office: 165 Days
• Field of Search: None
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/235 Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps F21K9/238 takes precedence
• CPC Class Codes: F21K 9/237 Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases F21K9/238 takes precedence
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21K 9/65 specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 13/14 the elements being filters or photoluminescent elements, reflectors and refractors
• CPC Class Codes: F21V 17/12 by screwing
• CPC Class Codes: F21V 17/14 Bayonet-type fastening
• CPC Class Codes: F21V 19/0025 the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 23/02 the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/10 Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/00 : Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 3/02 : characterised by the shape
• CPC Class Codes: F21V 5/10 : comprising photoluminescent material
• CPC Class Codes: F21V 7/00 : Reflectors for light sources characterised by cooling arrangements F21V29/505
• CPC Class Codes: F21V 7/06 : with parabolic curvature
• CPC Class Codes: F21V 9/00 : Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters coloured shades F21V1/00; elements characterised by cooling arrangements F21V29/502
• CPC Class Codes: F21V 9/30 : Elements containing photoluminescent material distinct from or spaced from the light source shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40
• CPC Class Codes: F21V 9/32 : characterised by the arrangement of the photoluminescent material
• CPC Class Codes: F21V 9/38 : Combination of two or more photoluminescent elements of different materials
• CPC Class Codes: F21Y 2101/00 : Point-like light sources
• CPC Class Codes: F21Y 2103/10 : comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2105/00 : Planar light sources
• CPC Class Codes: F21Y 2107/00 : Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/20 : on convex supports or substrates, e.g. on the outer surface of spheres
• CPC Class Codes: F21Y 2107/30 : on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2107/90 : on two opposite sides of supports or substrates
• CPC Class Codes: F21Y 2115/10 : Light-emitting diodes [LED]
• CPC Class Codes: F21Y 2115/15 : Organic light-emitting diodes [OLED]
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A solid state lamp includes a connector and an envelope with a strip inside the envelope.

Claims

1. A solid state lamp comprising:

a connector configured to electrically connect the solid state lamp to a power source, the connector defining an axis;

an envelope extending along the axis; and

a strip inside the envelope, the strip comprising;

a dielectric elongate substrate extending from a first end to a second end opposite the first end, the elongate substrate comprising a top surface having a length extending between the first and second ends of the elongate substrate and a width perpendicular to the length, the length being greater than the width,

the substrate comprising side surfaces on opposing sides of the width of the top surface;

a plurality of spaced-apart light-emitting diode (LED) unpackaged dies disposed on the top surface of the elongate substrate between the first and second ends, each of the LED unpackaged dies has a reflector arranged co-planar to the top surface and configured to reflect light from within the corresponding LED unpackaged die;

conductors arranged to provide electrical power to the LED unpackaged dies; and

a solid encapsulant encapsulating the LED unpackaged dies on the top surface of the substrate,

wherein the side surfaces of the elongate substrate are free of the solid encapsulant.

2. The solid state lamp of claim 1, wherein each of the LED unpackaged dies is arranged with the reflector adjacent the elongate substrate.

3. The solid state lamp of claim 2, wherein the reflector comprises an electrode of the corresponding LED unpackaged die.

4. The solid state lamp of claim 1, wherein the connector is a first connector arranged at the first end of the strip and the solid state lamp further comprises a second connector arranged at the second end of the strip, and the first and second connector electrically connect the solid state lamp to the power source.

5. The solid state lamp of claim 4, wherein the envelope is an elongate tubular envelope.

6. The solid state lamp of claim 1, wherein the solid encapsulant comprises a mixture of a phosphor and a binder.

7. The solid state lamp of claim 6, wherein the binder comprises a silicone.

8. The solid state lamp of claim 6, wherein the mixture of a phosphor and a binder is in contact with the LED unpackaged dies and the top surface of the substrate between the LED unpackaged dies, and wherein the solid encapsulant provides an outside surface of the strip.

9. The solid state lamp of claim 6, further comprising a phosphor layer disposed on the bottom surface of the substrate.

10. The solid state lamp of claim 1, wherein portions of the top surface are free of the solid encapsulant.

11. The solid state lamp of claim 1, wherein the solid encapsulant on the top surface of the substrate provides a first light emission surface through which the strip outputs a first intensity of light during operation, and a side of the strip opposite the first light emission surface provides a second light emission surface through which the strip outputs a second intensity of light during operation, and the first intensity of light is higher than the second intensity of light.

12. The solid state lamp of claim 11, wherein the solid encapsulant surrounding the LED unpackaged dies scatters light such that an intensity of light emitted in a first direction above the top surface of the strip differs from an intensity of a backscattered light emitted in a second direction opposite the first direction.

13. The solid state lamp of claim 11, wherein during operation the strip outputs first light in directions away from the top surface having a first spectral power distribution and the strip outputs second light in directions away from the bottom surface having a second spectral power distribution different from the first spectral power distribution.

14. The solid state lamp of claim 1, wherein the substrate is transmissive.

15. The solid state lamp of claim 14, wherein the transmissive substrate is a transparent substrate.

16. The solid state lamp of claim 1, further comprising a support structure, wherein the strip is supported by the support structure.

17. The solid state lamp of claim 16, wherein the support structure is electrically connected to the strip.

18. The solid state lamp of claim 16, wherein the support structure comprises a stiff rod.

19. The solid state lamp of claim 18, wherein the support structure comprises wires.

20. The solid state lamp of claim 18, wherein the strip is a helical strip.

21. The solid state lamp of claim 20, wherein the helical strip is a flexible helical strip.

22. The solid state lamp of claim 16, wherein the support structure has a first portion and a second portion different from the first portion, and the first end of the strip is attached to the first portion and the second end of the strip is attached to the second portion of the support structure.

23. The solid state lamp of claim 22, wherein the first portion of the support structure is disposed proximate the connector and the second portion of the support structure is disposed distal of the connector.

24. The solid state lamp of claim 16, wherein the strip comprises terminals coupled to the support structure.

25. The solid state lamp of claim 24, wherein the power source provides a mains voltage and the solid state lamp is configured to provide the mains voltage directly to the strip.

26. The solid state lamp of claim 1, wherein the strip is a free-standing strip supported only at the first end and extends from the connector, and the connector has a connection location configured to receive the free-standing strip at the first end.

27. The solid state lamp of claim 1, wherein the substrate has a thickness between 0.025 mm and 3 mm.

28. The solid state lamp of claim 1, wherein the strip further comprises additional electrical components and the LED unpackaged dies are electrically connected with the additional electrical components.

29. The solid state lamp of claim 1, wherein the LED unpackaged dies are arranged in multiple rows along the elongate substrate and the LED unpackaged dies in the strip are electrically connected in series.

30. The solid state lamp of claim 1, wherein the LED unpackaged dies are arranged between some of the electrical conductors and the substrate.