Apparatus and method of testing a wiring circuit
First Claim
1. An apparatus for testing a wiring circuit, the apparatus comprising:
- a circuit substrate having wirings formed in the circuit substrate and pads formed on an upper surface of the circuit substrate and connected to the wirings;
an electrode located below a lower surface of the circuit substrate;
an optical sensor located above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and
an optical unit located above the optical sensor and configured to irradiate light,wherein the optical sensor comprises;
an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and
a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate,wherein the first and second regions of the patterned reflective layer are provided at the lowermost portion of the optical sensor.
1 Assignment
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Accused Products
Abstract
An apparatus for testing a wiring circuit includes: a circuit substrate having wirings in the circuit substrate and pads on an upper surface of the circuit substrate and connected to the wirings; an electrode below a lower surface of the circuit substrate; an optical sensor above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit above the optical sensor and configured to irradiate light, wherein the optical sensor includes: an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region reflecting light incident on the optical substrate and a second region transmitting the light incident on the optical substrate.
22 Citations
18 Claims
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1. An apparatus for testing a wiring circuit, the apparatus comprising:
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a circuit substrate having wirings formed in the circuit substrate and pads formed on an upper surface of the circuit substrate and connected to the wirings; an electrode located below a lower surface of the circuit substrate; an optical sensor located above the upper surface of the circuit substrate and configured to detect a signal emitted from the upper surface of the circuit substrate; and an optical unit located above the optical sensor and configured to irradiate light, wherein the optical sensor comprises; an optical substrate whose optical characteristics are changed by the signal emitted from the upper surface of the circuit substrate; and a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate, wherein the first and second regions of the patterned reflective layer are provided at the lowermost portion of the optical sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An apparatus for testing a wiring circuit, the apparatus comprising:
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an electric signal generator figured to generate an electric signal for generating an electric field; a circuit substrate having an upper surface and a lower surface, the circuit substrate including wirings formed therein; a first electrode located on a first portion of the circuit substrate; a second electrode located on a second portion of the circuit substrate; an optical sensor configured to detect an electric field emitted from an upper surface of the circuit substrate; and an optical unit located on the optical sensor and configured to irradiate light, wherein the optical sensor comprises; an optical substrate whose optical characteristics are changed by the electric field emitted from the upper surface of the circuit substrate; and a patterned reflective layer located on a surface of the optical substrate facing the circuit substrate, the patterned reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate, wherein the patterned reflective layer has a stripe pattern formed by the first and second regions, or wherein the patterned reflective layer has a mesh pattern formed by the first and second regions. - View Dependent Claims (12, 13, 14)
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15. An apparatus for testing a wiring circuit, the apparatus comprising:
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a circuit substrate having wirings formed in the circuit substrate and pads formed on a first surface of the circuit substrate and connected to the wirings; an electrode spaced apart from a second surface of the circuit substrate and generating a first electric field towards the second surface of the circuit substrate; and an optical sensor spaced apart from the first surface of the circuit substrate and configured to detect a second electric field emitted from the first surface of the circuit substrate, wherein the optical sensor comprises; an optical substrate; and a reflective layer disposed on the optical substrate and facing the circuit substrate, the reflective layer having a first region for reflecting light incident on the optical substrate and a second region for transmitting the light incident on the optical substrate, wherein a signal image is obtained using the light reflected from the first region and an optical image is obtained using the light incident on the circuit substrate through the second region. - View Dependent Claims (16, 17, 18)
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Specification