Electromagnetic shielding film and preparation method therefor

• US 11,019,758 B2
• Filed: 06/21/2018
• Issued: 05/25/2021
• Est. Priority Date: 09/15/2017
• Status: Active Grant

• Current Assignee: Henan Guoan Electronic Material Co., Ltd.
• Original Assignee: Henan Guoan Electronic Material Co., Ltd.
• Inventors: Cui, Qingchen, Li, Guofa, Song, Wenjuan
• Primary Examiner(s): Nguyen, Khanh T
• Application Number:
  US16/340,513
• Publication Number:
  US 20190246528A1
• Time in Patent Office: 1,069 Days
• Field of Search: 252 6254
• CPC Class Codes: B32B 15/092 comprising epoxy resins
• CPC Class Codes: B32B 2307/212 Electromagnetic interference shielding
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: H05K 9/0083 comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence
• CPC Class Codes: H05K 9/0084 comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
• CPC Class Codes: H05K 9/0088 comprising a plurality of shielding layers; combining different shielding material structure

Abstract

Disclosed is an electromagnetic shielding film, comprising a release film layer, an insulation layer, a black insulation shielding layer, a metal layer, a conductive paste layer and a protective film layer which are sequentially connected. The conductive paste layer further comprises an electromagnetic wave absorbent. The electromagnetic wave absorbent is a mixture of one or more of carbon nanotubes, graphene and ferrite.

Claims

1. An electromagnetic shielding film comprising a release film layer (1), an insulating layer (2), a metal layer (4), a conductive paste layer (5) and a protective film layer (6) which are sequentially connected, wherein the electromagnetic shielding film further comprises a black insulating shielding layer (3) disposed between the insulating layer and the metal layer.

2. The electromagnetic shielding film of claim 1, wherein the release film layer and the protective film layer are a non-silicon release material.

3. The electromagnetic shielding film of claim 1, wherein the insulating layer and the black insulating shielding layer comprise 15-85% of insulating resin by weight, 2-18% of curing agent by weight, 0.1-12% of accelerator by weight, 5-40% of filler by weight and 8-45% of flame retardant by weight.

4. The electromagnetic shielding film of claim 3, wherein the insulating resin is at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, DCPD epoxy resin and biphenyl epoxy resin;

the curing agent is at least one of a phthalic anhydride type curing agent and a cyanamide type curing agent;

the accelerator is an imidazole accelerator;

the filler is at least one of aluminum hydroxide, calcium carbonate and carbon black; and

the flame retardant is at least one of a phosphorus-containing and a nitrogen-containing flame retardant.

5. The electromagnetic shielding film of claim 1, wherein the metal layer is a copper plated layer or a silver plated layer.

6. The electromagnetic shielding film of claim 1, wherein the conductive paste layer is epoxy resin to which conductive powder is added.

7. The electromagnetic shielding film of claim 6, wherein the conductive paste layer further comprises an electromagnetic wave absorbent.

8. The electromagnetic shielding film of claim 7, wherein the conductive powder is a mixture of one or more of silver-coated copper powder, copper powder and nickel powder;

and the electromagnetic wave absorbent is a mixture of one or more of carbon nanotubes, graphene and ferrite.