Acoustic imaging system architecture

• US 11,048,902 B2
• Filed: 08/17/2016
• Issued: 06/29/2021
• Est. Priority Date: 08/20/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Yeke Yazdandoost, Mohammad, Gozzini, Giovanni, King, Brian Michael, Yip, Marcus, Yousefpor, Marduke, Khajeh, Ehsan, Tucker, Aaron, Yang, Henry H.
• Primary Examiner(s): Baghdasaryan, Hovhannes
• Application Number:
  US15/239,455
• Publication Number:
  US 20170053151A1
• Time in Patent Office: 1,777 Days
• CPC Class Codes: A61B 5/1172 using fingerprinting
• CPC Class Codes: A61B 5/6898 Portable consumer electronic devices, e.g. music players, telephones, tablet computers
• CPC Class Codes: A61B 8/00 Diagnosis using ultrasonic, sonic or infrasonic waves imaging of objects using sonar G01S15/00
• CPC Class Codes: B06B 1/0207 Driving circuits specially adapted for particular applications, see the relevant subclass, e.g. G01; circuits for steering transducer arrays G10K11/34; basic circuits H03
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing

Abstract

An acoustic imaging system includes multiple transducers disposed to circumscribe a portion of substrate. An acoustic imaging system also includes a controller and an image resolver. The transducers convert electrical signals into mechanical energy and/or mechanical energy into electrical signals. The controller is adapted to apply an electrical signal to the transducers which, in response, induce a mechanical wave, such as a surface wave, into the circumscribed portion. The controller is also adapted to receive electrical signals from the transducers. The image resolver uses the electrical signals received by the controller in order to construct an image of an object in physical contact with the substrate.

Claims

1. An acoustic imaging sensor, the acoustic imaging sensor comprising:

a master controller;

a distribution of transducers disposed to circumscribe a portion of a substrate, each transducer of the distribution of transducers operable to;

operate in a drive mode in which the transducer mechanically deforms in response to a drive signal; and

operate in a sense mode in which the transducer produces an electronic signal when a section of the substrate adjacent the transducer mechanically deforms as a result of a mechanical wave propagating over or through the section;

a set of subgroup controllers, each communicably coupled to the master controller and conductively coupled each transducer of a respective subgroup of the distribution of transducers, each subgroup controller configured to;

generate at least one drive signal to cause a mechanical wave to be generated by the respective subgroup of the distribution of transducers, the mechanical wave directed across a top surface of and/or within the substrate toward the circumscribed portion of the substrate; and

communicate to the master controller an electrical signal received from at least one transducer of the respective subgroup of the distribution of transducers; and

an image resolver in communication with the master controller, the image resolver configured to construct an image of at least a portion of an object engaging the top surface of the substrate based on one or more electronic signals received by the master controller.

2. The acoustic imaging sensor of claim 1, wherein each subgroup controller of the set of subgroup controllers is disposed below the distribution of transducers.

3. The acoustic imaging sensor of claim 1, wherein each subgroup controller of the set of subgroup controllers comprises:

a drive circuit configured to generate the at least one drive signal; and

a sense circuit configured to receive the electronic signal.

4. The acoustic imaging sensor of claim 3, wherein each respective sense circuit is disposed below the distribution of transducers.

5. The acoustic imaging sensor of claim 3, wherein each respective sense circuit is disposed adjacent to the drive circuit.

6. The acoustic imaging sensor of claim 1, wherein each of the distribution of transducers are coupled to a bottom surface of the substrate.

7. The acoustic imaging sensor of claim 1, wherein:

the substrate is rectangular; and

the distribution of transducers is arranged as a row adjacent to an upper perimeter of the circumscribed portion.

8. The acoustic imaging sensor of claim 7, wherein the distribution of transducers is a first distribution of transducers and the acoustic imaging sensor further comprises:

a second distribution of transducers, the second distribution of transducers arranged as a column adjacent to a side perimeter of the circumscribed portion.

9. The acoustic imaging sensor of claim 1, the distribution of transducers is arranged as a row adjacent a rectilinear edge of the substrate.

10. The acoustic imaging sensor of claim 1, the distribution of transducers is arranged as multiple parallel rows adjacent a rectilinear edge of the substrate.

11. The acoustic imaging sensor of claim 1, wherein the substrate is formed from glass, sapphire, or metal.

12. The acoustic imaging sensor of claim 1, wherein a transducer of the distribution of transducers is formed from a material configured to expand and contract in response to a voltage signal.