Semiconductor devices and methods for manufacturing the same
First Claim
1. A semiconductor device, comprising:
- a first substrate;
a first light-emitting diode disposed on the first substrate;
a first insulating layer disposed on the first substrate and adjacent to the first light-emitting diode;
an adhesive structure disposed on the first insulating layer, comprising;
a first side facing the first light-emitting diode; and
a second side opposite to the first side;
a second substrate disposed on the adhesive structure;
an optical structure in contact with at least one of the first side and the second side,a light conversion layer disposed between the second substrate and the second side of the adhesive structure; and
a second insulating layer disposed on the second side of the adhesive structure and adjacent to the light conversion layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device is provided. The semiconductor device includes a first substrate. The semiconductor device also includes a first light-emitting diode on the first substrate. The semiconductor device further includes a first insulating layer on the first substrate and adjacent to the first light-emitting diode. In addition, the semiconductor device includes an adhesive structure on the first insulating layer. The adhesive structure includes a first side facing the first light-emitting diode and a second side opposite to the first side. The semiconductor device also includes a second substrate disposed on the adhesive structure. The semiconductor device further includes an optical structure in contact with at least one of the first side and the second side.
4 Citations
17 Claims
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1. A semiconductor device, comprising:
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a first substrate; a first light-emitting diode disposed on the first substrate; a first insulating layer disposed on the first substrate and adjacent to the first light-emitting diode; an adhesive structure disposed on the first insulating layer, comprising; a first side facing the first light-emitting diode; and a second side opposite to the first side; a second substrate disposed on the adhesive structure; an optical structure in contact with at least one of the first side and the second side, a light conversion layer disposed between the second substrate and the second side of the adhesive structure; and a second insulating layer disposed on the second side of the adhesive structure and adjacent to the light conversion layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device, comprising:
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a first substrate; a first light-emitting diode disposed on the first substrate; a first insulating layer disposed on the first substrate and adjacent to the first light-emitting diode; an adhesive structure disposed on the first insulating layer, comprising; a first side facing the first light-emitting diode; and a second side opposite to the first side; a second substrate disposed on the adhesive structure; an optical structure in contact with at least one of the first side and the second side; and a light conversion layer disposed between the first light-emitting diode and the adhesive structure.
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10. A method for manufacturing a semiconductor device, comprising:
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providing a first substrate; forming a first light-emitting diode on the first substrate; forming a first insulating layer on the first substrate and adjacent to the first light-emitting diode; forming an adhesive structure on the first insulating layer, wherein the adhesive structure comprises a first side facing the first light-emitting diode and a second side opposite to the first side; forming a second substrate on the adhesive structure; forming an optical structure in contact with at least one of the first side and the second side, forming a light conversion layer between the second substrate and the second side of the adhesive structure; and forming a second insulating layer on the second side of the adhesive structure and adjacent to the light conversion layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification