Chip-on-board modular lighting system and method of manufacture

  • US 11,092,321 B2
  • Filed: 05/04/2020
  • Issued: 08/17/2021
  • Est. Priority Date: 12/22/2017
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a thermally conductive plate defining an opening;

    a plurality of light-emitting devices (LEDs) on a surface of a substrate, the substrate being thermally coupled to the thermally conductive plate, the substrate including first electrical power contacts on the surface, and the substrate being disposed at least partially within the opening in the thermally conductive plate; and

    an electronics board having second electrical power contacts,the electronics board disposed on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

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