Chip-on-board modular lighting system and method of manufacture
First Claim
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1. A system comprising:
- a thermally conductive plate defining an opening;
a plurality of light-emitting devices (LEDs) on a surface of a substrate, the substrate being thermally coupled to the thermally conductive plate, the substrate including first electrical power contacts on the surface, and the substrate being disposed at least partially within the opening in the thermally conductive plate; and
an electronics board having second electrical power contacts,the electronics board disposed on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.
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Abstract
Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.
13 Citations
16 Claims
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1. A system comprising:
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a thermally conductive plate defining an opening; a plurality of light-emitting devices (LEDs) on a surface of a substrate, the substrate being thermally coupled to the thermally conductive plate, the substrate including first electrical power contacts on the surface, and the substrate being disposed at least partially within the opening in the thermally conductive plate; and an electronics board having second electrical power contacts, the electronics board disposed on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A system comprising:
a plurality of light-emitting device (LED) sub-systems, each of the plurality of LED sub-systems comprising; a thermally conductive plate defining an opening, a plurality of light-emitting devices (LEDs) on a surface of a substrate, the substrate being thermally coupled to the thermally conductive plate, the substrate including first electrical power contacts on the surface, and the substrate being disposed at least partially within the opening in the thermally conductive plate, and an electronics board having second electrical power contacts, a dimmer interface circuit and a direct current (DC) voltage interface configured to receive a DC voltage from a single external DC power supply, the electronics board disposed on the thermally conductive plate with the first and second electrical power contacts electrically coupled together. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
Specification