Ceramic electronic component

• US 11,101,074 B2
• Filed: 11/19/2018
• Issued: 08/24/2021
• Est. Priority Date: 09/21/2018
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Shin, Dong Hwi, Kim, Dong Yeong, Kim, Do Yeon, Shin, Woo Chul
• Primary Examiner(s): Ramaswamy, Arun
• Application Number:
  US16/195,181
• Publication Number:
  US 20200098523A1
• Time in Patent Office: 1,009 Days
• Field of Search: 3613063, 3613212, 3613213, 3613014, 3613061, 3613211
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/1227 based on alkaline earth titanates
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01G 4/2325 characterised by the material of the terminals
• CPC Class Codes: H01G 4/248 the terminals embracing or surrounding the capacitive element, e.g. caps H01G4/252 takes precedence
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence

Abstract

A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1≤t5/(t3+t4)*100<17.5 in the case in which t3+t4 is less than or equal to 100 micrometers and satisfies 0.3≤t5/(t3+t4)*100<4.38 in the case in which t3+t4 is more than 100 micrometers.

Claims

1. A ceramic electronic component comprising:

a body including dielectric layers and a plurality of internal electrodes disposed to face each other with the dielectric layers interposed therebetween, the body having first and second surfaces disposed to oppose each other in a stacking direction of the plurality of internal electrodes, third and fourth surfaces connected to the first and second surfaces and disposed to oppose each other, and fifth and sixth surfaces connected to the first to fourth surfaces and disposed to oppose each other; and

an external electrode including a connection portion disposed on one of the third and fourth surfaces and band portions respectively extending from the connection portion to a portion of the first surface, a portion of the second surface, a portion of the fifth surface, and a portion of the sixth surface,

wherein the external electrode includes an electrode layer connected to the internal electrode, a conductive resin layer disposed on the electrode layer, a nickel (Ni) plating layer disposed on the conductive resin layer, and a tin (Sn) plating layer disposed on the Ni plating layer,

each of the band portions and the connection portion includes a portion of the electrode layer, a portion of the conductive resin layer, a portion of the nickel (Ni) plating layer, and a portion of the tin (Sn) plating layer, and

1≤

t5/(t3+t4)*100<

17.5, where t3 is an electrode layer thickness in one of the band portions, t4 is a conductive resin layer thickness in the one of the band portions, and t5 is a nickel (Ni) plating layer thickness in the one of the band portions, and t3+t4 is less than or equal to 100 micrometers.

2. The ceramic electronic component of claim 1, wherein a thickness of the tin (Sn) plating layer is within a range from 0.5 micrometer to 12 micrometers.

3. The ceramic electronic component of claim 1, wherein one of the internal electrodes has a thickness less than 1 micrometer, and one of the dielectric layers has a thickness less than 2.8 micrometers.

4. The ceramic electronic component of claim 1, wherein td>

2*te, where to is a thickness of one of the internal electrodes and td is a thickness of one of the dielectric layers.

5. The ceramic electronic component of claim 1, wherein the electrode layer includes a glass and at least one conductive metal selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

6. The ceramic electronic component of claim 1, wherein the conductive resin layer includes a base resin and at least one conductive metal selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

7. The ceramic electronic component of claim 1, wherein 0.5 micrometer≤

t5<

7 micrometers.

8. A ceramic electronic component comprising:

a body including dielectric layers and a plurality of internal electrodes disposed to face each other with the dielectric layers interposed therebetween, the body having first and second surfaces disposed to oppose each other in a stacking direction of the plurality of internal electrodes, third and fourth surfaces connected to the first and second surfaces and disposed to oppose each other, and fifth and sixth surfaces connected to the first to fourth surfaces and disposed to oppose each other; and

an external electrode including a connection portion disposed on one of the third and fourth surfaces and band portions respectively extending from the connection portion to a portion of the first surface, a portion of the second surface, a portion of the fifth surface, and a portion of the sixth surface,

wherein the external electrode includes an electrode layer connected to the internal electrode, a conductive resin layer disposed on the electrode layer, a nickel (Ni) plating layer disposed on the conductive resin layer, and a tin (Sn) plating layer disposed on the Ni plating layer,

each of the band portions and the connection portion includes a portion of the electrode layer, a portion of the conductive resin layer, a portion of the nickel (Ni) plating layer, and a portion of the tin (Sn) plating layer, and

0.3≤

t5/(t3+t4)*100<

4.38, where t3 is an electrode layer thickness in one of the band portions, t4 is a conductive resin layer thickness in the one of the band portions, and t5 is a nickel (Ni) plating layer thickness in the one of the band portions, and t3+t4 is greater than 100 micrometers.

9. The ceramic electronic component of claim 8, wherein a thickness of the tin (Sn) plating layer is within a range from 0.5 micrometer to 12 micrometers.

10. The ceramic electronic component of claim 8, wherein one of the internal electrodes has a thickness less than 1 micrometer, and one of the dielectric layers has a thickness less than 2.8 micrometers.

11. The ceramic electronic component of claim 8, wherein td>

2*te, where to is a thickness of one of the internal electrodes and td is a thickness of one of the dielectric layers.

12. The ceramic electronic component of claim 8, wherein the electrode layer includes a glass and at least one conductive metal selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

13. The ceramic electronic component of claim 8, wherein 0.5 micrometer≤

t5<

7 micrometers.