Bendable panel and method of fabricating same

• US 11,114,426 B2
• Filed: 04/02/2019
• Issued: 09/07/2021
• Est. Priority Date: 12/03/2018
• Status: Active Grant

• Current Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Ltd.
• Original Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Ltd.
• Inventors: Wang, Mingliang
• Primary Examiner(s): Schoenholtz, J. E.
• Application Number:
  US16/349,283
• Publication Number:
  US 20210183840A1
• Time in Patent Office: 889 Days
• Field of Search: None
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H05K 1/0281 Reinforcement details thereof
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/057 Shape retainable
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A bendable panel and a method of fabricating same are provided. The bendable panel improves a current display panel to provide better support and impact resistance to a bent region of a display panel. In addition, a protection performance, such as corrosion resistance, on a line in the bent region is improved.

Claims

1. A bendable panel, comprising:

a flexible display panel comprising a flexible substrate as a base, wherein the flexible substrate comprises an active display area and a binding end positioned on a side of the active display area;

a driving chip disposed on the binding end, wherein the binding end is bent toward a direction away from a light emitting side of the flexible display panel, such that the driving chip is positioned on a back surface of the flexible substrate;

a back film layer disposed on the back surface of the flexible substrate, wherein the back film layer is configured to support and protect the flexible substrate;

a foam layer disposed on the back surface of the back film layer, wherein the foam layer is configured to protect the flexible substrate; and

a support plate;

wherein the binding end comprises a first terminal portion adjacent to the active display area, a second terminal portion adjacent to the driving chip, and a bent portion connected to the first terminal portion and the second terminal portion and having a bent shape; and

wherein a bent region disposed on an inner surface of the bent portion is provided with a glue;

wherein the support plate is attached to a back surface of the second terminal portion, the support plate covers at least the back surface of the second terminal portion on which the driving chip is disposed, a configuration of the support plate, the back surface of the second terminal portion, and the driving chip fills a height difference between the foam layer and the second terminal portion.

2. The bendable panel according to claim 1, further comprising a film circuit layer disposed on the flexible substrate and connected between the active display area and the driving chip, and the film circuit layer is attached to the bent portion and bent in a same direction as the bent portion.

3. The bendable panel according to claim 2, further comprising a conductive line disposed on a surface of the film circuit layer and connected to the flexible display panel and the driving chip.

4. The bendable panel according to claim 2, further comprising an ultraviolet glue layer disposed on an outer surface of the film circuit layer.

5. The bendable panel according to claim 1, wherein the driving chip is directly attached to the flexible substrate.

6. The bendable panel according to claim 1, wherein the driving chip is indirectly secured to the flexible substrate by a flip chip.

7. A method of fabricating a bendable panel, wherein the bendable panel comprises:

a flexible display panel comprising a flexible substrate as a base, wherein the flexible substrate comprises an active display area and a binding end positioned on a side of the active display area;

a driving chip disposed on the binding end, wherein the binding end is bent toward a direction away from a light emitting side of the flexible display panel, such that the driving chip is positioned on a back surface of the flexible substrate;

a back film layer disposed on the back surface of the flexible substrate, wherein the back film layer is configured to support and protect the flexible substrate;

a foam layer disposed on the back surface of the back film layer, wherein the foam layer is configured to protect the flexible substrate; and

a support plate;

wherein the binding end comprises a first terminal portion adjacent to the active display area, a second terminal portion adjacent to the driving chip, and a bent portion connected to the first terminal portion and the second terminal portion and having a bent shape; and

wherein a bent region disposed on an inner surface of the bent portion is provided with a glue;

wherein the support plate is attached to a back surface of the second terminal portion, the support plate covers at least the back surface of the second terminal portion on which the driving chip is disposed, a configuration of the support plate, the back surface of the second terminal portion, and the driving chip fills a height difference between the foam layer and the second terminal portion;

wherein the method comprises;

(a) binding the driving chip to the binding end of the flexible substrate;

(b) providing the glue on the surface of the binding end facing away from the light emitting side of the flexible substrate;

(c) after the glue is applied to the binding end, bending the binding end facing away from the light emitting side of the flexible display panel, such that the driving chip is disposed on the back surface of the flexible substrate; and

curing the glue.

8. The method according to claim 7, wherein in step (b), the glue is provided by spraying or coating.

9. The method according to claim 7, wherein in step (d), the glue is cured by high temperature or standing.