Chip electronic component and board having the same
First Claim
Patent Images
1. A chip electronic component comprising:
- a substrate;
a first internal coil part disposed on a first surface of the substrate;
a second internal coil part disposed on a second surface of the substrate opposing the first surface thereof;
a via penetrating through the substrate to connect the first and second internal coil parts to each other;
first and second via pads disposed on the first surface and the second surface of the substrate, respectively, to cover the via; and
a magnetic body enclosing the first and second internal coil parts,wherein a portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side, andthe second side has a curvature that remains substantially the same as a curvature of a neighboring area in the first or second internal coil part disposed directly adjacent to the respective first or second via pad.
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Abstract
There are provided a chip electronic component and a board having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto.
64 Citations
20 Claims
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1. A chip electronic component comprising:
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a substrate; a first internal coil part disposed on a first surface of the substrate; a second internal coil part disposed on a second surface of the substrate opposing the first surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; first and second via pads disposed on the first surface and the second surface of the substrate, respectively, to cover the via; and a magnetic body enclosing the first and second internal coil parts, wherein a portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side, and the second side has a curvature that remains substantially the same as a curvature of a neighboring area in the first or second internal coil part disposed directly adjacent to the respective first or second via pad. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A chip electronic component comprising:
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a substrate; a first internal coil part disposed on a first surface of the substrate; a second internal coil part disposed on a second surface of the substrate opposing the first surface thereof in a direction; a via penetrating through the substrate to connect the first and second internal coil parts to each other; first and second via pads disposed on the first surface and the second surface of the substrate, respectively, to cover the via; and a magnetic body enclosing the first and second internal coil parts and overlapping the via in said direction, wherein a portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side, and both neighboring areas, with respect to a winding direction of the first or second internal coil part, of said portion of the first or second internal coil part directly adjacent to the respective first or second via pad are disposed radially farther than the respective first or second via pad. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A chip electronic component comprising:
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a substrate; a first internal coil part disposed on a first surface of the substrate; a second internal coil part disposed on a second surface of the substrate opposing the first surface thereof in a direction; a via penetrating through the substrate to connect the first and second internal coil parts to each other; first and second via pads disposed on the first surface and the second surface of the substrate, respectively, to cover the via; and a magnetic body enclosing the first and second internal coil parts and overlapping the via in said direction, wherein a portion of the first or second internal coil part disposed directly adjacent to the respective first or second via pad includes a first side having a recess accommodating the respective first or second via pad, and a second side opposing the first side, and a shape of the second side is similar to a shape of a neighboring area in the first or second internal coil part disposed directly adjacent to the respective first or second via pad. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification