Method for improving the liquid dispensing of IC packages

• US 20010001070A1
• Filed: 12/26/2000
• Published: 05/10/2001
• Est. Priority Date: 12/22/1998
• Status: Active Grant

• Current Assignee: Chipmos Technologies Incorporated (Chipmos)
• Original Assignee: Neopac Semiconductor Corp.
• Inventors: Hsu, Chi-Hsing, Hsu, Wen-Fu, Chung, Chin-Hsing
• Granted Patent: US 6,395,584 B2
• Time in Patent Office: Days
• US Class Current: 438/126
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49171 : with encapsulating
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material

Abstract

A flat plate mold with special treatment or a metallic flat plate mold is adopted to flatten the resin painted over on IC chips during package dispensing process, such that it is able to maintain a consistent flatness of the surface of IC products after dispensing for laser or ink marking. And heat sinks can be attached to the flat plate mold to increase the heat-dissipating rate of IC products after dispensing.

Claims

1. A method for improving the liquid dispensing of IC packages, during a liquid dispensed package process of an IC chip, after filling liquid resin but before being solidified, a flat plate mold having a shape to be fitted with the shape of liquid resin on said IC package and painted over by a coating which is hard to adhere with said liquid resin and an air vent being provided at proper position of said flat plate mold is adopted to flatten said resin;

extra resin and air between said liquid resin and said flat plate mold can be vented away smoothly through said air vent;

after said liquid resin is solidified and said flat plate mold is removed, a marker of pin one dot will be left on the upper smooth surface of said resin.

2. A method for improving the liquid dispensing of IC packages according to

claim 1

, wherein the circumference of said flat plate mold is bent downward and is able to cover a substrate of said IC chip when said flat plate mold covers said resin;

and an air vent is provided at where said circumference of said flat plate mold covers said substrate;

to be used for flattening said liquid resin on said IC chip after dispensing.

3. A method for improving the liquid dispensing of IC packages, during a liquid dispensed package process of an IC chip, after filling liquid resin but before being solidified, a flat plate mold having a shape to be fitted with the shape of liquid resin on said IC chip is made of a metal and an air vent is provided at proper position of said flat plate mold, a surface of said flat plate mold is treated by roughening or protruding for pressing over said liquid resin on said IC chip tightly, to be used for flattening said liquid resin on said IC chip after dispensing and for heat dissipation;

extra resin and air between said liquid resin and said flat plate mold can be vented away smoothly through said air vent;

after said liquid resin is solidified, said flat plate mold remains on said resin for heat dissipation.

4. A method for improving the liquid dispensing of IC packages according to

claim 3

, wherein the circumference of said flat plate mold is bent downward and is able to cover a substrate of said IC chip when said flat plate mold covers said resin;

and an air vent is provided at where said circumference of said flat plate mold covers said substrate;

to be used for flattening said liquid resin on said IC chip after dispensing and for heat dissipation.

5. A method for improving the liquid dispensing of IC packages according to

claim 3

, wherein a metal heat sink is provided at a surface of said flat plate mold pressed over said resin, and is formed integrally or adhered with said flat plate mold;

when said flat plate mold is tightly pressed over said resin, said metal heat sink will be extended into said resin to contact or approach to said IC chip, thus said IC chip is easy to dissipate heat;

a front surface of said metal heat sink is also treated by roughening or protruding.

6. A method for improving the liquid dispensing of IC packages according to

claim 4

, wherein a metal heat sink is provided at a surface of said flat plate mold pressed over said resin, and is formed integrally or adhered with said flat plate mold;

when said flat plate mold is tightly pressed over said resin, said metal heat sink will be extended into said resin to contact or approach to said IC chip, thus said IC chip is easy to dissipate heat;

a front surface of said metal heat sink is also treated by roughening or protruding.

7. A method for improving the liquid dispensing package of MAP IC chip, during a liquid dispensed package process of a matrix array package (MAP) IC chip, after filling liquid resin but before being solidified, a flat plate mold is designed to be fitted with many MAP IC chips on a substrate, such that each IC chip has a corresponding air vent respectively on said flat plate mold;

and to be used for flattening the surface of said resin after filling said resin;

extra resin and air between said liquid resin and said flat plate mold can be vented away smoothly through said air vents;

after said liquid resin is solidified and said flat plate mold is removed, a marker of pin one dot for each IC chip will be left on the upper smooth surface of said resin; and

then said MAP is sawed into many individual IC products.

8. A method for improving the liquid dispensing package of MAP IC chip, during a liquid dispensed package process of a matrix array package (MAP) IC chip, after filling liquid resin but before being solidified, a flat plate mold made of a metal is designed to be fitted with many MAP IC chips on a substrate, such that each IC chip has a corresponding air vent respectively on said flat plate mold;

and to be used for flattening the surface of said resin after filling said resin and for heat dissipation;

extra resin and air between said liquid resin and said flat plate mold can be vented away smoothly through said air vents;

after said liquid resin is solidified, said flat plate mold remains on said resin for heat dissipation, a marker of pin one dot for each IC chip will be left on upper surface of said flat plate mold; and

then MAP is sawed into many individual IC products.

9. A method for improving the liquid dispensing package of MAP IC chip according to

claim 8

, wherein a metal heat sink is provided respectively for each IC at a surface of said flat plate mold pressed over said resin, and is formed integrally or adhered with said flat plate mold;

when said flat plate mold is tightly pressed over said resin, said metal heat sinks will be extended into said resin to contact or approach to IC chips, thus IC chips are easy to dissipate heat;

a front surface of said metal heat sink is also treated by roughening or protruding.