Intelligent binning for electrically repairable semiconductor chips
First Claim
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1. A test system for testing semiconductor devices comprising:
- testing apparatus for performing at least one test of a first type on at least one semiconductor device to identify one or more types of failure in the at least one semiconductor device;
processing circuitry for communicating with the testing apparatus and for determining at least one type of failure of a number of types of failures, said processing circuitry providing at least one signal indicative of the at least one type of failure;
decision circuitry for receiving the at least one signal indicative of the at least one type of failure of a number of types of failures and for considering the at least one type of failure of a number of types of failures of one of designating the at least one semiconductor device for an additional procedure, designating the at least one semiconductor device for repair, and designating the at least one semiconductor device for additional tests of the first type, said decision circuitry designating the at least one semiconductor device for the additional procedure if the at least one type of failure of a number of the identified types of failures is within a first number set; and
designating the at least one semiconductor device for repair if the number of the identified types of failures is within a second number set.
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Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.
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41 Claims
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1. A test system for testing semiconductor devices comprising:
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testing apparatus for performing at least one test of a first type on at least one semiconductor device to identify one or more types of failure in the at least one semiconductor device;
processing circuitry for communicating with the testing apparatus and for determining at least one type of failure of a number of types of failures, said processing circuitry providing at least one signal indicative of the at least one type of failure;
decision circuitry for receiving the at least one signal indicative of the at least one type of failure of a number of types of failures and for considering the at least one type of failure of a number of types of failures of one of designating the at least one semiconductor device for an additional procedure, designating the at least one semiconductor device for repair, and designating the at least one semiconductor device for additional tests of the first type, said decision circuitry designating the at least one semiconductor device for the additional procedure if the at least one type of failure of a number of the identified types of failures is within a first number set; and
designating the at least one semiconductor device for repair if the number of the identified types of failures is within a second number set. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A test system for testing at least one semiconductor device comprising:
test apparatus for performing tests of a first type on the at least one semiconductor device, for identifying failures in the at least one semiconductor device, and determining at least one failure of the number of identified failures, the test apparatus performing one of;
designating the at least one semiconductor device for an additional procedure when the number of the identified types of failures is within a first number set;
designating the at least one semiconductor device for repair when the number of the identified types of failures is within a second number set; and
designating the at least one semiconductor device for additional tests of the first type when the number of the identified types of failures is within a third number set.
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33. A test system for testing at least one semiconductor device comprising:
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test equipment performing at least one test of a plurality of tests of a first type on the at least one semiconductor device to identify at least one failure of a plurality of types of failures in the at least one semiconductor device;
processing circuitry communicating with the test equipment, determining at least one failure of a number of types of failures, and providing signals indicative thereof, and decision circuitry receiving the signals indicative of at least one failure of the number of types of failures, the decision circuitry determining the number of types of failures and performing one of designating the at least one semiconductor device for an additional procedure, designating the at least one semiconductor device for repair, and designating the at least one semiconductor device for additional tests of the first type, the decision circuitry classifying failures by class and numbers of the identified types of failures, a total number of identified types of failures equaling a sum of the identified types of failures for each class, and the decision circuitry considering the total number of identified types of failures and the number of identified types of failures in at least one of the classes of a plurality of types of failures.
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34. A test system for testing at least one semiconductor device comprising:
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test equipment connected to the at least one semiconductor device performing tests of a first type on the at least one semiconductor device for identifying at least one failure of a plurality of types of failures in the at least one semiconductor device;
processing circuitry communicating with the test equipment determining a total number of identified types of failures and classifying the identified failures by a class and a number for each class determined, the total number of identified types of failures equaling a sum of the identified types of failures for each class; and
decision circuitry designating the at least one semiconductor device for an additional procedure when the total number of the identified types of failures is within a first number set, the decision circuitry designating the at least one semiconductor device for repair when the total number of identified types of failures is within a second number set and the number of identified failures in a predetermined class is not within an auxiliary number set, and the decision circuitry performing additional tests of the first type on the at least one semiconductor device when one of the total number of the identified types of failures is within a third number set and the number of identified types failures in the predetermined class is within the auxiliary number set.
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35. A method for testing at least one semiconductor device comprising:
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performing tests of a first type on at least one semiconductor device to identify types of failures in the at least one semiconductor device;
determining the number of identified types of failures;
designating the at least one semiconductor device having at least one identified type of failure for an additional procedure when the number of the identified types of failures is within a first number set;
determining if the number of identified types of failures is within a second number set;
repairing the at least one semiconductor device when the number of the identified types of failures is within the second number set; and
performing other tests of the first type on the at least one semiconductor device when the number of the identified types of failures is within a third number set. - View Dependent Claims (36, 37, 38, 39, 40, 41)
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Specification