Vacuum processing apparatus for semiconductor process
First Claim
1. A vacuum processing apparatus for a semiconductor process, comprising:
- a process container forming an airtight process chamber, and comprising a container main body and an upper cover detachably disposed on the container main body;
a supporting member configured to support a target substrate in the process chamber;
a gas supply system configured to supply a process gas into the process chamber;
an exhaust system configured to exhaust the process chamber and set the process chamber at a vacuum; and
a detaching device configured to attach/detach the upper cover relative to the container main body, the detaching device comprising a rotational mechanism configured to rotatably support the upper cover, an up-and-down movement mechanism configured to support the rotational mechanism and the upper cover to be movable up and down, and a lateral movement mechanism configured to support the up-and-down movement mechanism, the rotational mechanism, and the upper cover to be movable in a lateral direction.
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Accused Products
Abstract
A plasma etching apparatus includes a process container formed of a container main body and an upper casing combined with each other. A detaching device is provided to move the upper casing between a mounted position where the upper casing is put on the container main body, and a retreated position where the upper casing is removed from the container main body. The detaching device supports the upper casing to be rotatable, movable up and down, and movable in a lateral direction, relative to the container main body. The retreated position is arranged such that the upper casing does not interfere with the container main body when the upper casing is rotated there.
23 Citations
17 Claims
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1. A vacuum processing apparatus for a semiconductor process, comprising:
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a process container forming an airtight process chamber, and comprising a container main body and an upper cover detachably disposed on the container main body;
a supporting member configured to support a target substrate in the process chamber;
a gas supply system configured to supply a process gas into the process chamber;
an exhaust system configured to exhaust the process chamber and set the process chamber at a vacuum; and
a detaching device configured to attach/detach the upper cover relative to the container main body, the detaching device comprising a rotational mechanism configured to rotatably support the upper cover, an up-and-down movement mechanism configured to support the rotational mechanism and the upper cover to be movable up and down, and a lateral movement mechanism configured to support the up-and-down movement mechanism, the rotational mechanism, and the upper cover to be movable in a lateral direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A vacuum processing apparatus for a semiconductor process, comprising:
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a process container forming an airtight process chamber, and comprising a lower casing and an upper casing detachably joined to each other at a position on a wall forming the process chamber;
a seal member interposed between the lower casing and the upper casing;
a worktable on which the target substrate is mounted in the process chamber, the worktable being attached to the lower casing;
a gas supply system configured to supply a process gas into the process chamber, and comprising a showerhead including a plurality of gas spouting holes disposed in the process chamber, the showerhead being attached to the upper casing;
an exhaust system configured to exhaust the process chamber and set the process chamber at a vacuum; and
a detaching device configured to move the upper casing between a mounted position where the upper casing is put on the lower casing, and a retreated position where the upper casing is removed from the lower casing, the detaching device supporting the upper casing to be rotatable, movable up and down, and movable in a lateral direction, relative to the lower casing, such that the upper casing does not interfere with the lower casing when the upper casing is rotated at the retreated position. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification