Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements

  • US 20010029064A1
  • Filed: 06/11/2001
  • Published: 10/11/2001
  • Est. Priority Date: 03/03/1999
  • Status: Active Grant
First Claim
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1. A separating method of semiconductor elements comprising:

  • a separation step for holding on a chuck a group of semiconductor elements as an object, being stuck on an adhesive sheet under a condition of a semiconductor wafer and cut out into a unit of the semiconductor element, and striping said adhesive sheet from the group of semiconductor elements; and

    a storing step into a tray, for picking up the semiconductor elements by a desired unit thereof from the group of semiconductor elements being stripped with the adhesive sheet therefrom in said stripping step and being held on the chuck, so as to be stored into a tray.

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