Delivery of dissolved ozone
First Claim
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1. A method for stripping a layer from a semiconductor wafer, the method comprising:
- introducing ozone into a process chamber;
activating a water spray for a first predetermined amount of time, thereby creating a water layer over a layer of a semiconductor wafer, wherein the water layer transports high concentrations of the ozone to the semiconductor wafer;
deactivating the water spray for a second predetermined amount of time, thereby controlling a thickness of the water layer; and
re-activating and re-deactivating the water spray until the ozone substantially removes portions of the layer from the semiconductor wafer.
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Abstract
An apparatus and method for delivering ozone to a workpiece. In one embodiment, fluid is sprayed onto a workpiece placed in an ozone-rich environment. Alternatively, ozone is mixed with the fluid prior to spraying the fluid onto the workpiece. When spraying the fluid, the invention pulses the fluid at desired rates to create a substantially uniform layer of ozone-rich fluid on the workpiece. In another embodiment, the workpiece is also slowly rotated during at least a portion of the time the layer of ozone-rich fluid is applied to the workpiece.
13 Citations
62 Claims
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1. A method for stripping a layer from a semiconductor wafer, the method comprising:
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introducing ozone into a process chamber;
activating a water spray for a first predetermined amount of time, thereby creating a water layer over a layer of a semiconductor wafer, wherein the water layer transports high concentrations of the ozone to the semiconductor wafer;
deactivating the water spray for a second predetermined amount of time, thereby controlling a thickness of the water layer; and
re-activating and re-deactivating the water spray until the ozone substantially removes portions of the layer from the semiconductor wafer. - View Dependent Claims (2, 3, 4, 5)
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6. An ozone shower system, comprising:
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an ozone source configured to supply ozone to a process chamber;
a sprayer connected to a fluid source such that fluid sprays over a workpiece in the process chamber;
a pump connected to the fluid source; and
a selector valve connected to the pump, the selector valve configured to selectively pulse the fluid through the sprayer. - View Dependent Claims (7, 8, 9)
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10. A method comprising:
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introducing a reagent to an ambient;
activating a solution spray in the ambient for a first time period; and
deactivating the solution spray for a second time period, thereby increasing the efficiency of a reaction of the reagent and a workpiece. - View Dependent Claims (11, 12, 13, 14)
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15. A reaction chamber comprising:
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a gas input;
a plurality of nozzles connected to a nozzle manifold;
a wafer cartridge holding wafers;
a first fluid line connected to the nozzle manifold; and
a second water line configured to divert water flow away from the first fluid line.
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16. A reaction chamber comprising:
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at least one nozzle connected to a fluid supply and configured to pulse fluid onto a workpiece; and
a rotator wherein the rotator rotates the workpiece at a velocity ranging from approximately 100 rpm to stationary.
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17. An apparatus comprising:
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at least one wafer processing chamber wherein an ozone rich environment exists within the wafer-processing chamber;
a sprayer; and
a pulsating fluid source, the pulsating fluid source configured to pulse a solution through the sprayer into the ozone rich environment. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. An apparatus comprising:
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at least one semiconductor processing chamber; and
a pulsating fluid source, the pulsating fluid source configured to pulse an ozone-rich solution into the semiconductor-processing chamber. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35)
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36. A method comprising:
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introducing a reagent into an ambient; and
pulsing a solution spray in the ambient, thereby increasing the efficiency of a reaction of the reagent. - View Dependent Claims (37, 38, 39, 40)
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41. An ozone shower system comprising:
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a process chamber; and
a pump, connected to the process chamber and configured to pulse a solution into the process chamber. - View Dependent Claims (42, 43, 44, 45)
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- 46. An apparatus comprising a pulsator that pulses a solution into an ozone-rich environment to create an ozone-rich solution.
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54. An apparatus comprising:
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a rotating platform that is configured to rotate a workpiece; and
a pulsator that pulses a solution into an ozone-rich environment to create an ozone-rich solution on the workpiece.
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- 55. An apparatus comprising a sprayer that periodically pulses an ozone-rich solution onto a wafer.
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62. An apparatus comprising:
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a rotating platform that is configured to rotate a workpiece; and
a pulsator that pulses an ozone-rich solution on the workpiece.
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Specification