A CONDUCTIVE PARTICLE TO CONDUCTIVELY BOND CONDUCTIVE MEMBERS TO EACH OTHER, AN ANISOTROPIC ADHESIVE CONTAINING THE CONDUCTIVE PARTICLE, A LIQUID CRYSTAL DISPLAY DEVICE USING THE ANISOTROPIC CONDUCTIVE ADHESIVE, A METHOD FOR MANUFACTURING THE LIQUID CRYSTAL DISPLAY DEVICE

• US 20010046021A1
• Filed: 08/27/1998
• Published: 11/29/2001
• Est. Priority Date: 08/28/1997
• Status: Abandoned Application

• Current Assignee: Ricoh Company Limited, Soken Chemical & Engineering Co., Ltd.
• Original Assignee: Ricoh Company Limited, Soken Chemical & Engineering Co., Ltd.
• Inventors: YAMAZAKI, TSUTOMU, SAKATA, IKUMI, KOZUKA, TAKESHI
• Application Number:
  US09/141,021
• Publication Number:
  US 20010046021A1
• Time in Patent Office: Days
• US Class Current: 349/150
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/29399 Coating material
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H05K 2201/0221 Insulating particles having an electrically conductive coating
• CPC Class Codes: H05K 2201/0233 Deformable particles insulating particles having an electrically conductive coating H05K2201/0221
• CPC Class Codes: H05K 2203/0307 Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A conductive particle used for an anisotropic conductive adhesive provides an anisotropic conductive bonding between terminal electrodes without deforming a wiring pattern or the terminal electrode of a circuit board. A conductive layer is formed on a surface of a core particle of the conductive particle. The conductive particle has a yield point within a range of degree of deformation from 5% to 40% so that a modulus of compressive deformation of the conductive particle drastically increases at the yield point.

Claims

1. A conductive particle for an anisotropic conductive adhesive, comprising:

a core particle; and

a conductive layer formed on a surface of said core particle,

wherein said conductive particle has a yield point within a range of degree of deformation from 5% to 40%, a modulus of compressive deformation of said conductive particle drastically increasing at said yield point.

2. The conductive particle as claimed in

claim 1

, wherein when a compressive elastic deformation characteristic K of said conductive particle is defined as K=(3/2^½

)·

(S<sup>−

{fraction (3/2)}</sup>)·

(R<sup>−

½</sup>

)·

F, a value of K is 10 to 100 (kgf/mm²) when a degree of compressive deformation of said conductive particle is 40%, where F is a compression force (kgf), S is a compression strain (mm) and R is a radius (mm) of said conductive particle.

3. A conductive particle for an anisotropic conductive adhesive, comprising:

a core particle; and

a conductive layer formed on a surface of said core particle,

wherein said conductive particle shows a characteristic of a hard elastic sphere until a compression force reaches 2 gf/particle to 3 gf/particle at an ordinary temperature, and said conductive particle crushes and begins to plastically deform when the compression force reaches 2 gf/particle to 3 gf/particle.

4. The conductive particle as claimed in

claim 3

, wherein when a compressive elastic deformation characteristic K of said conductive particle is defined as K=(3/2^½

)·

(S<sup>−

½</sup>

)·

(R<sup>−

½</sup>

)·

F, a value of K is 10 to 100 (kgf/mm²) when a degree of compressive deformation of said conductive particle is 40%, where F is a compression force (kgf), S is a compression strain (mm) and R is a radius (mm) of said conductive particle.

5. A conductive particle for an anisotropic conductive adhesive, comprising:

a core particle made of a resin material; and

a conductive layer formed on an entire surface of said core particle, said conductive layer being formed by metal coating,

wherein said core particle has a yield point within a range of a compression force from 2 gf/particle to 3 gf/particle, a modulus of compressive deformation of said conductive particle drastically increasing so that said conductive particle starts to crush and plastically deform at said yield point.

6. The conductive particle as claimed in

claim 5

, wherein when a compressive elastic deformation characteristic K of said conductive particle is defined as K=(3/2^½

)·

(S<sup>−

{fraction (3/2)}</sup>)·

(R<sup>−

½</sup>

)·

F, a value of K is 10 to 100 (kgf/mm²) when a degree of compressive deformation of said conductive particle is 40%, where F is a compression force (kgf), S is a compression strain (mm) and R is a radius (mm) of said conductive particle.

7. An anisotropic conductive adhesive comprises:

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a core particle; and

a conductive layer formed on a surface of said core particle,

wherein said conductive particle has a yield point within a range of degree of deformation from 5% to 40%, a modulus of compressive deformation of said conductive particle drastically increasing at said yield point.

8. The anisotropic conductive adhesive as claimed in

claim 7

, wherein said anisotropic conductive adhesive is formed as a film material, and a relationship between a diameter D of said conductive particle and a thickness T of said film material is represented by D≧

T.

9. The anisotropic conductive adhesive as claimed in

claim 7

, wherein an average diameter of said conductive particles is within a range from 2 μ

m to 30 μ

m, and a CV value of said conductive particles is less than 20%.

10. The anisotropic conductive adhesive as claimed in

claim 7

, wherein said anisotropic conductive adhesive is used for bonding a terminal electrode of a liquid crystal display element using a resin board to a terminal electrode of a flexible wiring board by thermo-compression bonding, and a degree of compression deformation of said conductive particles when the thermo-compression bonding is performed is within a range from 20% to 80%.

11. An anisotropic conductive adhesive comprises:

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a core particle; and

a conductive layer formed on a surface of said core particle,

wherein said conductive particle shows a characteristic of a hard elastic sphere until a compression force reaches 2 gf/particle to 3 gf/particle at an ordinary temperature, and said conductive particle crushes and begins to plastically deform when the compression force reaches 2 gf/particle to 3 gf/particle.

12. The anisotropic conductive adhesive as claimed in

claim 11

, wherein said anisotropic conductive adhesive is formed as a film material, and a relationship between a diameter D of said conductive particle and a thickness T of said film material is represented by D≧

T.

13. The anisotropic conductive adhesive as claimed in

claim 11

, wherein an average diameter of said conductive particles is within a range from 2 μ

m to 30 μ

m, and a CV value of said conductive particles is less than 20%.

14. The anisotropic conductive adhesive as claimed in

claim 11

, wherein said anisotropic conductive adhesive is used for bonding a terminal electrode of a liquid crystal display element using a resin board to a terminal electrode of a flexible wiring board by thermo-compression bonding, and a degree of compression deformation of said conductive particles when the thermo-compression bonding is performed is within a range from 20% to 80%.

15. An anisotropic conductive adhesive comprises:

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a core particle made of a resin material; and

a conductive layer formed on an entire surface of said core particle, said conductive layer being formed by metal coating,

wherein said core particle has a yield point within a range of a compression force from 2 gf/particle to 3 gf/particle, a modulus of compressive deformation of said conductive particle drastically increasing so that said conductive particle starts to crush and plastically deform at said yield point.

16. The anisotropic conductive adhesive as claimed in

claim 15

, wherein said anisotropic conductive adhesive is formed as a film material, and a relationship between a diameter D of said conductive particle and a thickness T of said film material is represented by D≧

T.

17. The anisotropic conductive adhesive as claimed in

claim 15

, wherein an average diameter of said conductive particles is within a range from 2 μ

m to 30 μ

m, and a CV value of said conductive particles is less than 20%.

18. The anisotropic conductive adhesive as claimed in

claim 15

, wherein said anisotropic conductive adhesive is used for bonding a terminal electrode of a liquid crystal display element using a resin board to a terminal electrode of a flexible wiring board by thermo-compression bonding, and a degree of compression deformation of said conductive particles when the thermo-compression bonding is performed is within a range from 20% to 80%.

19. A liquid crystal display device comprises:

a liquid crystal display element having a terminal electrode for external connection, said liquid crystal display element using a resin board;

a flexible wiring board having a terminal electrode bonded to said terminal electrode of said liquid crystal display element; and

an anisotropic conductive adhesive for bonding said terminal electrode of said flexible wiring board to said terminal electrode of said liquid crystal display element,

wherein said anisotropic conductive adhesive comprises;

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a core particle; and

a conductive layer formed on a surface of said core particle,

wherein said conductive particle has a yield point within a range of degree of deformation from 5% to 40%, a modulus of compressive deformation of said conductive particle drastically increasing at said yield point.

20. A liquid crystal display device comprises:

a liquid crystal display element having a terminal electrode for external connection, said liquid crystal display element using a resin board;

a flexible wiring board having a terminal electrode bonded to said terminal electrode of said liquid crystal display element; and

an anisotropic conductive adhesive for bonding said terminal electrode of said flexible wiring board to said terminal electrode of said liquid crystal display element,

wherein said anisotropic conductive adhesive comprises;

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a core particle; and

a conductive layer formed on a surface of said core particle,

wherein said conductive particle shows a characteristic of a hard elastic sphere until a compression force reaches 2 gf/particle to 3 gf/particle at an ordinary temperature, and said conductive particle crushes and begins to plastically deform when the compression force reaches 2 gf/particle to 3 gf/particle.

21. A liquid crystal display device comprises:

a liquid crystal display element having a terminal electrode for external connection, said liquid crystal display element using a resin board;

a flexible wiring board having a terminal electrode bonded to said terminal electrode of said liquid crystal display element; and

an anisotropic conductive adhesive for bonding said terminal electrode of said flexible wiring board to said terminal electrode of said liquid crystal display element,

wherein said anisotropic conductive adhesive comprises;

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a core particle made of a resin material; and

a conductive layer formed on an entire surface of said core particle, said conductive layer being formed by metal coating,

wherein said core particle has a yield point within a range of a compression force from 2 gf/particle to 3 gf/particle, a modulus of compressive deformation of said conductive particle drastically increasing so that said conductive particle starts to crush and plastically deform at said yield point.

22. A conductive particle for an anisotropic conductive adhesive, comprising:

a particle body; and

an irregularity formed on a surface of said particle body,

wherein said conductive particle is provided in an insulating adhesive so as to produce the anisotropic conductive adhesive used for conductively bonding a plurality of conductive members; and

a degree of the irregularity formed on the surface of the particle body is sufficient for eliminating the insulating adhesive between said conductive particle and each of the conductive members so that said conductive particle contacts each of said conductive members when the anisotropic conductive adhesive is subjected to a predetermined pressure during a curing process of the anisotropic conductive adhesive.

23. The conductive particle as claimed in

claim 22

, wherein the irregularity has a depth ranging from 0.05 μ

m to 2 μ

m, and a density of peaks of the irregularity is 1,000 peaks/mm² to 500,000 peaks/mm².

24. The conductive particle as claimed in

claim 22

, wherein said particle body comprises:

a particle core; and

a conductive layer formed on said particle core,

wherein the irregularity is defined by a surface roughness of said conductive layer.

25. The conductive particle as claimed in

claim 22

, wherein said conductive particle shows a characteristic of a hard elastic sphere until a compression force reaches 2 gf/particle to 3 gf/particle at an ordinary temperature, and said conductive particle crushes and begins to plastically deform when the compression force reaches 2 gf/particle to 3 gf/particle.

26. An anisotropic conductive adhesive comprises:

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a particle body; and

an irregularity formed on a surface of said particle body,

wherein said conductive particle is provided in an insulating adhesive so as to produce the anisotropic conductive adhesive used for conductively bonding a plurality of conductive members; and

a degree of the irregularity formed on the surface of the particle body is sufficient for eliminating the insulating adhesive between said conductive particle and each of the conductive members so that said conductive particle contacts each of said conductive members when the anisotropic conductive adhesive is subjected to a predetermined pressure during a curing process of the anisotropic conductive adhesive.

27. The anisotropic conductive adhesive as claimed in

claim 26

, wherein said anisotropic conductive adhesive is formed as a film material, and a relationship between a diameter D of said conductive particle and a thickness T of said film material is represented by D>

T.

28. The anisotropic conductive adhesive as claimed in

claim 26

, wherein an average diameter of said conductive particles is within a range of 2 μ

m to 30 μ

m, and a CV value of said conductive particles is less than 20%.

29. The anisotropic conductive adhesive as claimed in

claim 26

, wherein said anisotropic conductive adhesive is used for bonding a terminal electrode of a liquid crystal display element using a resin board to a terminal electrode of a flexible wiring board by performing thermo-compression bonding, and a degree of compression deformation of said conductive particles when the thermo-compression bonding is performed is within a range from 20% to 80%.

30. A liquid crystal display device comprises:

a liquid crystal display element having a terminal electrode for external connection, said liquid crystal display element using a resin board;

a flexible wiring board having a terminal electrode bonded to said terminal electrode of said liquid crystal display element; and

an anisotropic conductive adhesive for bonding said terminal electrode of said flexible wiring board to said terminal electrode of said liquid crystal display element,

wherein said anisotropic conductive adhesive comprises;

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive,

wherein each of the conductive particles comprises;

a particle body; and

an irregularity formed on a surface of said particle body,

wherein said conductive particle is provided in an insulating adhesive so as to produce the anisotropic conductive adhesive used for conductively bonding a plurality of conductive members; and

a degree of the irregularity formed on the surface of the particle body is sufficient for eliminating the insulating adhesive between said conductive particle and each of the conductive members so that said conductive particle contacts each of said conductive members when the anisotropic conductive adhesive is subjected to a predetermined pressure during a curing process of the anisotropic conductive adhesive.

31. An anisotropic conductive adhesive comprises:

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive at a dispersion density ranging from 300 pieces/mm² to 650 pieces/mm².

32. The anisotropic conductive adhesive as claimed in

claim 31

, wherein an average diameter of said conductive particles is within a range from 2 μ

m to 30 μ

m.

33. The anisotropic conductive adhesive as claimed in

claim 31

, wherein each of said conductive particles shows a characteristic of a hard elastic sphere until a compression force reaches 2 gf/particle to 3 gf/particle at an ordinary temperature, and said conductive particle crushes and begins to plastically deform when the compression force reaches 2 gf/particle to 3 gf/particle.

34. The anisotropic conductive adhesive as claimed in

claim 31

, wherein each of said conductive particles comprises:

a particle body; and

an irregularity formed on a surface of said particle body,

wherein each of said conductive particles is provided in an insulating adhesive so as to produce said anisotropic conductive adhesive used for conductively bonding a plurality of conductive members; and

a degree of the irregularity formed on the surface of the particle body is sufficient for eliminating the insulating adhesive between said conductive particle and each of the conductive members so that said conductive particle contacts each of said conductive members when said anisotropic conductive adhesive is subjected to a predetermined pressure during a curing process of said anisotropic conductive adhesive.

35. The anisotropic conductive adhesive as claimed in

claim 31

, wherein said anisotropic conductive adhesive is formed as a film material, and a relationship between a diameter D of said conductive particle and a thickness T of said film material is represented by D≧

T.

36. A liquid crystal display device comprises:

a liquid crystal display element having terminal electrodes for external connection, said liquid crystal display element using a resin board;

a flexible wiring board having terminal electrodes bonded to said terminal electrode of said liquid crystal display element; and

an anisotropic conductive adhesive for bonding said terminal electrodes of said flexible wiring board to said terminal electrodes of said liquid crystal display element,

wherein said anisotropic conductive adhesive comprises;

an insulating adhesive; and

conductive particles dispersed in said insulating adhesive at a dispersion density ranging from 300 pieces/mm² to 650 pieces/mm².

37. The liquid crystal display device as claimed in

claim 36

, wherein pitches of said terminal electrodes of said liquid crystal display device are within a range from 150 μ

m to 400 μ

m.

38. A method for manufacturing a liquid crystal display device, comprising the steps of:

preparing an anisotropic conductive adhesive comprising an insulating adhesive and conductive particles dispersed in said insulating adhesive at a dispersion density ranging from 320 pieces/mm² to 600 pieces/mm², said conductive particles having an average diameter of 20 μ

m; and

bonding terminal electrodes of a liquid crystal display element using a resin board to terminal electrodes of a flexible wiring board by using said anisotropic conductive adhesive and performing thermo-compression bonding.

39. The method as claimed in

claim 38

, wherein said terminal electrodes of said liquid crystal display element are arranged with pitches ranging from 150 μ

m to 400 μ

m.

40. The method as claimed in

claim 38

, wherein a thickness of said terminal electrodes of said flexible wiring board is 18 μ

m, and a thickness of said anisotropic conductive adhesive is 16±

3 μ

m measured before the thermo-compression bonding is performed.