Face to face chip
First Claim
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1. An integrated circuit device comprising:
- a first semiconductor die having first signal pads formed on a major surface thereof;
a second semiconductor die having second signal pads formed on a major surface thereof; and
said first die arranged in face-to-face manner with said second die so that at least some of said first signal pads are capacitively coupled to at least some of said second signal pads.
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Abstract
An integrated circuit device includes first and second arrays of semiconductor dice. Each array of dice is arranged in face-to-face relation to the other array of dice, thus forming a lower layer of dice and an upper layer of dice. The layers are aligned so that each upper layer die straddles two or more of the lower layer dice, thus defining overlap regions. In the overlap regions, signal pads of one layer are aligned with corresponding signal pads of the other layer. The two layers are spaced apart, thus creating a capacitance-based communication path between the upper and lower layers via the signal paths.
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Citations
24 Claims
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1. An integrated circuit device comprising:
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a first semiconductor die having first signal pads formed on a major surface thereof;
a second semiconductor die having second signal pads formed on a major surface thereof; and
said first die arranged in face-to-face manner with said second die so that at least some of said first signal pads are capacitively coupled to at least some of said second signal pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit device comprising:
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a first plurality of dice arranged in a first planar array;
a first set of signal pads disposed on surfaces of the first plurality of dice;
a second plurality of dice arranged in a second planar array;
a second set of signal pads disposed on surfaces of the second plurality of dice;
wherein the first plurality of dice and the second plurality of dice are positioned within the integrated circuit device such that each die of the first plurality of dice partially overlie at least two dice of the second plurality of dice, thereby defining areas of overlap; and
wherein the first plurality of dice and the second plurality of dice are positioned within the integrated circuit device such that at least some of the first set of signal pads are capacitively coupled to corresponding signal pads of the second set of signal pads. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 20, 21, 22, 23, 24)
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19. A method of fabricating an integrated circuit device, comprising:
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providing a plurality of first dice, said dice each having a first polygonal shape and having signal pads formed on a surface thereof;
providing a plurality of second dice, said dice each having a second polygonal shape and having signal pads formed on a surface thereof;
arranging said first dice to form a first repeating pattern;
arranging said second dice to form a second repeating pattern;
further arranging said first dice so that signal pads thereof are in face-to-face relation with signal pads of said second dice;
aligning said first dice so that each first die overlaps at least two of said second dice, thereby defining overlap areas;
further aligning said first dice so that signal pads thereof located in said overlap areas coincide with some signal pads of said second dice;
capacitively coupling some signal pads of said first dice to some signal pads of said second dice in said overlap areas, thereby providing a signal path between said plurality of first and second dice.
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Specification