Pressure sensor having semiconductor sensor chip

  • US 20020023500A1
  • Filed: 07/16/2001
  • Published: 02/28/2002
  • Est. Priority Date: 08/25/2000
  • Status: Active Grant
First Claim
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1. A pressure sensor comprising:

  • a cylindrical sensor case having a depressed portion formed at one longitudinal end, the depressed portion communicating with an outside pressure source through a through-hole formed in the sensor case;

    a sensor chip mounted in the depressed portion to receive a pressure supplied from the outside pressure source;

    a plurality of terminals disposed around the depressed portion for electrically connecting the sensor chip to an outside circuit;

    a sealing material charged in a space between a sidewall of the depressed portion and a side periphery of the sensor chip for hermetically closing the through-hole with the sensor chip; and

    a plurality of charging holes for charging the sealing material into the space, each charging hole being formed in a space between two neighboring terminals.

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