Heat sink with alignment and retaining features
First Claim
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1. A semiconductor device assembly comprising:
- a first substrate having a first surface, a second surface, and a plurality of circuits located on the first surface and the second surface;
a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate;
a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture;
a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; and
at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate.
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Accused Products
Abstract
An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
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Citations
34 Claims
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1. A semiconductor device assembly comprising:
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a first substrate having a first surface, a second surface, and a plurality of circuits located on the first surface and the second surface;
a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate;
a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture;
a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; and
at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device assembly comprising:
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a first substrate having a first surface, a second surface, a plurality of circuits on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface;
a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate;
a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, said first heat transfer device extending substantially parallel and outwardly beyond a periphery of said first substrate;
at least one connector connected to a circuit on the second surface of the first substrate;
a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface;
a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and
at least one first connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one connector extending through the at least one slot in the first heat transfer device. - View Dependent Claims (8, 9, 10, 11, 13, 15, 16, 17, 18, 19)
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12. A semiconductor device assembly comprising:
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a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least two circuits located on the first surface and the second surface;
a first semiconductor device located directly on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate;
at least one connector connected to a circuit on the second surface of the first substrate;
a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface;
a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate;
at least one first connector connected to a circuit on the second surface of the first substrate;
at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and
an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
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14. A semiconductor device assembly having a plurality of substrates comprising:
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a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface;
a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate;
a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture;
a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate configured to extend through the at least one aperture in the first heat transfer member; and
at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate.
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20. A semiconductor device assembly comprising:
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a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least two circuits located on the first surface and the second surface;
a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate;
a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, said first heat transfer member configured to extend substantially parallel and outwardly beyond a periphery of said first substrate;
at least one connector connected to a circuit on the second surface of the first substrate;
a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface;
a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the second substrate; and
at least one first connector is connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one connector configured to extend through the at least one slot in the first heat transfer member. - View Dependent Claims (21, 22, 23, 24, 25, 26, 28, 30, 31, 32, 33, 34)
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27. A semiconductor device assembly having a plurality of substrates comprising:
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a first substrate having a first surface, a second surface, a plurality of circuits located on one of the first surface and the second surface, at least one circuit located on the first surface and the second surface;
a first semiconductor device directly contacting the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate;
at least one connector connected to a circuit on the second surface of the first substrate;
a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface;
a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate;
at least one first connector connected to a circuit on the second surface of the first substrate;
at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and
an enclosure configured to contain the first substrate and the second substrate therein, the enclosure having a portion thereof configured to sealingly engage a portion of the first substrate.
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29. A semiconductor device assembly having a plurality of semiconductor devices comprising:
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a first substrate having a first surface, a second surface, a plurality of circuits located on one of the first surface and the second surface, at least one circuit located on the first surface and the second surface;
a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate;
a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture;
a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device;
at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate;
a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate;
a third substrate having a first surface, a second surface, at least one circuit located on the first surface thereof;
a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and
at least one connector extending between a circuit on the second surface of the third substrate and a circuit on the first surface of the first substrate.
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Specification