Optical coupling semiconductor apparatus and method for manufacturing the same

• US 20020025593A1
• Filed: 08/28/2001
• Published: 02/28/2002
• Est. Priority Date: 08/28/2000
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Matsuo, Yoshihiko
• Granted Patent: US 6,590,232 B2
• Time in Patent Office: Days
• US Class Current: 438/31
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02322 comprising luminescent members, e.g. fluorescent sheets upon the device
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate

Abstract

An object of the invention is to raise and stabilize the efficiency of light transmission between a light-emitting device and a light-receiving device. A light-transmissive resin projection has a constant height over the extent from the light-emitting device to the light-receiving device and is shaped triangular in section. Since an outer package is white-colored, the interface between the light-transmissive resin projection and the outer package is also white-colored and, hence, the light reflectivity of the interface is high. Accordingly, light emitted from the light-emitting device is reflected at faces of the light-transmissive resin projection, gathered to the vertex portion, guided to the light-receiving device, and received by the light-receiving device. At this time, light is transmitted from the light-emitting device to the light-receiving device without being dispersed within the light-transmissive resin projection. Further, since the light transmission distance is short, the light transmission efficiency is high and is stabilized.

Claims

1. An optical coupling semiconductor apparatus comprising:

a light-emitting device;

a light-receiving device;

lead frames carrying the light-emitting device and the light-receiving device, respectively, at locations spaced apart from each other; and

a light-transmissive resin projection having a longitudinally extending tapered vertex portion, the projection functioning as an optical path extending between the light-emitting device and the light-receiving device, having a nearly constant height, reflecting light emitted from the light-emitting device to gather the light to the vertex portion, and guiding the light thus gathered to the light-receiving device.

2. The optical coupling semiconductor apparatus of claim 1, wherein the light-emitting device and the light-receiving device have a light-emitting face and a light-receiving face, respectively, which are located on substantially the same reference plane.

3. The optical coupling semiconductor apparatus of claim 1, wherein the light-transmissive resin projection has a sectional configuration with the vertex portion and two sides defining the vertex portion.

4. The optical coupling semiconductor apparatus of claim 1, wherein the light-transmissive resin projection is formed of an epoxy resin which is capable of setting through cationic polymerization.

5. The optical coupling semiconductor apparatus of claim 1, wherein the light-transmissive resin projection is dome-shaped at a location in a vicinity of the light-receiving device to converge light at the light-receiving device.

6. The optical coupling semiconductor apparatus of claim 1, wherein a distance 1 between the light-emitting device and the light-receiving device and a height L of the light-transmissive resin projection are set to satisfy the following relation:

l≧

L.

7. The optical coupling semiconductor apparatus of claim 1, wherein the light-transmissive resin projection has a width larger than a width of a light-emitting area of the light-emitting device and a width of a light-receiving area of the light-receiving device.

8. The optical coupling semiconductor apparatus of claim 1, wherein the light-transmissive resin projection has opposite ends located as superposed on the light-emitting device and the light-receiving device, respectively.

9. The optical coupling semiconductor apparatus of claim 1, wherein the light-transmissive resin projection has one end adjoining the light-receiving device.

10. The optical coupling semiconductor apparatus of claim 1, wherein the light-emitting device is shaped into a prism having at least two side walls oriented toward the light-receiving device.

11. A method for manufacturing an optical coupling semiconductor apparatus, comprising the steps of:

mounting a light-emitting device and a light-receiving device on respective lead frames and connecting the light-emitting device and the light-receiving device to the corresponding lead frames by die bonding or wire bonding;

forming a light-transmissive resin projection having a longitudinally extending tapered vertex portion and a substantially constant height, the resin projection functioning as an optical path between the light-emitting device and the light-receiving device; and

sealing the light-emitting device, the light-receiving device and the light-transmissive resin projection with a lightproof resin.

12. The method for manufacturing an optical coupling semiconductor apparatus of claim 11, wherein the lightproof resin contains a flame-retardant resin which is white-colored and has an increased light reflectivity at least at a location in a vicinity of an interface with the light-transmissive resin projection.